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TSB12LV01APZ

TSB12LV01APZ

Manufacturer No:

TSB12LV01APZ

Manufacturer:

Texas Instruments

Description:

IC HP 3.3V LINK LAYER 100LQFP

Datasheet:

Datasheet

Delivery:

Payment:

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TSB12LV01APZ Specifications

  • Type
    Parameter
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    -
  • Function
    -
  • Protocol
    -
  • Supplier Device Package
    100-LQFP (14x14)
  • Package / Case
    100-LQFP
  • DigiKey Programmable
    Not Verified
  • Packaging
    Bag
  • Product Status
    Obsolete
  • Series
    -
The TSB12LV01APZ is a high-performance integrated circuit chip designed for use in FireWire (IEEE 1394) applications. It offers several advantages and can be applied in various scenarios, including:1. High-speed data transfer: The TSB12LV01APZ supports data transfer rates of up to 400 Mbps, making it suitable for applications that require fast and efficient data transmission.2. Low power consumption: This chip is designed to operate with low power consumption, making it ideal for portable devices and applications where power efficiency is crucial.3. Plug-and-play functionality: The TSB12LV01APZ supports plug-and-play functionality, allowing devices to be connected and disconnected without the need for system restarts. This feature simplifies the user experience and enhances convenience.4. Hot-swapping capability: The chip supports hot-swapping, enabling devices to be connected or disconnected while the system is still running. This feature is particularly useful in scenarios where devices need to be added or removed on the fly, such as in a daisy-chained FireWire network.5. Multiple device connections: The TSB12LV01APZ supports multiple device connections, allowing for the creation of complex FireWire networks. This makes it suitable for applications that require the interconnection of multiple devices, such as digital cameras, external hard drives, audio interfaces, and video equipment.6. Audio and video streaming: The chip's high-speed data transfer capabilities make it well-suited for applications involving real-time audio and video streaming. It can be used in devices like video cameras, audio interfaces, and digital mixers to ensure smooth and uninterrupted data transmission.7. Industrial automation: The TSB12LV01APZ can be applied in industrial automation scenarios where high-speed data transfer is required for real-time control and monitoring. It can be used in applications such as robotics, machine vision systems, and industrial control systems.8. Medical devices: The chip's low power consumption and high-speed data transfer capabilities make it suitable for medical devices that require efficient data transmission and minimal power usage. It can be used in applications like patient monitoring systems, medical imaging devices, and diagnostic equipment.Overall, the TSB12LV01APZ integrated circuit chip offers advantages such as high-speed data transfer, low power consumption, plug-and-play functionality, and hot-swapping capability. Its application scenarios range from consumer electronics to industrial automation and medical devices.
TSB12LV01APZ Relevant information