PM8354-NI
Manufacturer No:
PM8354-NI
Manufacturer:
Description:
IC ETHERNET PHYSICAL LAYER CNTRL
Datasheet:
Delivery:
Payment:
In Stock : 0
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PM8354-NI Specifications
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TypeParameter
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Supplier Device Package-
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Package / Case-
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Operating Temperature-
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Current - Supply-
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Voltage - Supply1.8V
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Standards-
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Interface-
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FunctionPhysical Layer Controller
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ProtocolEthernet
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DigiKey ProgrammableNot Verified
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PackagingTray
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PackagingBulk
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Product StatusObsolete
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Series-
The PM8354-NI integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The PM8354-NI chips offer high-performance networking capabilities, making them suitable for demanding applications. 2. Power Efficiency: These chips are designed to be power-efficient, reducing energy consumption and heat generation. 3. Scalability: The PM8354-NI chips can be easily scaled to meet the requirements of different network sizes and configurations. 4. Flexibility: These chips support various networking protocols and interfaces, providing flexibility in network design and deployment. 5. Reliability: The PM8354-NI chips are built with robust features and mechanisms to ensure reliable network operation.Application Scenarios: 1. Data Centers: The PM8354-NI chips are commonly used in data centers for high-speed networking, enabling efficient data transfer and processing. 2. Telecommunication Networks: These chips are suitable for telecommunication networks, including carrier-grade Ethernet switches and routers. 3. Enterprise Networks: The PM8354-NI chips can be used in enterprise networks to provide reliable and high-performance connectivity for businesses. 4. Cloud Computing: These chips are utilized in cloud computing infrastructure to support fast and efficient data transfer between servers and storage systems. 5. Internet Service Providers (ISPs): The PM8354-NI chips are employed by ISPs to deliver high-speed internet connectivity to customers.Overall, the PM8354-NI integrated circuit chips offer advanced networking capabilities, making them ideal for various applications that require high performance, power efficiency, scalability, flexibility, and reliability.
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