PAS6502B-F3GI

PAS6502B-F3GI

Manufacturer No:

PAS6502B-F3GI

Manufacturer:

Microsemi Corporation

Description:

IC ETHERNET I2C/MII/SPI 336FCBGA

Datasheet:

Datasheet

Delivery:

Payment:

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PAS6502B-F3GI Specifications

  • Type
    Parameter
  • Supplier Device Package
    336-FCBGA (17x17)
  • Package / Case
    336-BGA, FCBGA
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    10/100/1000 Base-T PHY
  • Interface
    I²C, MII, SPI
  • Function
    -
  • Protocol
    Ethernet
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The PAS6502B-F3GI integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: These chips are designed to operate with low power requirements, making them suitable for battery-powered devices and energy-efficient applications. 2. High performance: The chips offer high processing speed and performance, enabling them to handle complex tasks and calculations efficiently. 3. Compact size: The chips are designed to be compact, allowing for easy integration into small electronic devices and systems. 4. Cost-effective: The chips are cost-effective, making them suitable for mass production and large-scale applications. 5. Versatility: The chips can be used in a wide range of applications, thanks to their flexible design and compatibility with various systems and devices.Application Scenarios: 1. Internet of Things (IoT): The chips can be used in IoT devices, such as smart home appliances, wearable devices, and industrial sensors, where low power consumption and compact size are crucial. 2. Consumer Electronics: The chips can be utilized in smartphones, tablets, and other portable devices, providing high-performance processing capabilities while minimizing power consumption. 3. Embedded Systems: The chips can be integrated into embedded systems, such as automotive electronics, industrial control systems, and robotics, where compact size, low power consumption, and high performance are essential. 4. Medical Devices: The chips can be used in medical devices, such as patient monitoring systems, portable medical equipment, and implantable devices, where low power consumption and high performance are critical for extended battery life and accurate data processing. 5. Communication Systems: The chips can be employed in communication systems, including routers, switches, and network equipment, where high-speed processing and low power consumption are required for efficient data transmission and network management.Overall, the PAS6502B-F3GI integrated circuit chips offer a combination of low power consumption, high performance, compact size, and versatility, making them suitable for a wide range of applications in various industries.