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USB5807-I/KD

USB5807-I/KD

Manufacturer No:

USB5807-I/KD

Manufacturer:

Microchip Technology

Description:

IC HUB CONTROLLER USB 100VQFN

Datasheet:

Datasheet

Delivery:

Payment:

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USB5807-I/KD Specifications

  • Type
    Parameter
  • Supplier Device Package
    100-VQFN (12x12)
  • Package / Case
    100-VFQFN Exposed Pad
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    -
  • Voltage - Supply
    1.2V, 3.3V
  • Standards
    USB 3.1
  • Interface
    SPI
  • Function
    Hub Controller
  • Protocol
    USB
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The USB5807-I/KD chips are integrated circuit (IC) chips commonly used in wireless audio devices. Some advantages and application scenarios of the USB5807-I/KD chips include:1. Compact and integrated solution: The USB5807-I/KD chips offer a compact and integrated design, combining multiple functionalities required for wireless audio transmission and reception. This significantly reduces the overall circuit complexity and design effort.2. USB interface: These chips feature a USB interface, allowing seamless integration with various USB host devices such as computers, laptops, smartphones, and tablets. This enables convenient and widespread compatibility across a range of devices.3. Stable and efficient data transmission: The USB5807-I/KD chips provide reliable and high-quality audio data transmission, minimizing signal loss and interference. They support low-latency and stable connections, ensuring uninterrupted audio streaming.4. Power efficiency: These integrated circuits are designed to be power-efficient, allowing longer battery life in portable devices such as wireless headphones, earphones, and speakers. They incorporate power-saving mechanisms to optimize energy consumption.5. Easy implementation: The USB5807-I/KD chips come with comprehensive documentation and support, making them relatively easy to implement in audio devices. They offer flexible configuration options and software development kits (SDKs) to simplify the integration process.Application scenarios for USB5807-I/KD chips include:1. Wireless headphones and earphones: These IC chips can be used in wireless headphones or earphones to provide stable and high-quality audio transmission over Bluetooth or other wireless protocols. The USB interface allows easy pairing and connectivity with host devices.2. Wireless speakers: The USB5807-I/KD chips can be integrated into wireless speaker systems, enabling users to stream audio wirelessly from their devices. The USB interface can be used to connect to a host device or act as a standalone music player.3. Gaming headsets: These chips can be utilized in gaming headsets, providing efficient and low-latency audio transmission for an immersive gaming experience. The USB connectivity allows seamless integration with gaming consoles, computers, or gaming smartphones.4. In-car entertainment systems: The USB5807-I/KD chips can be employed in wireless audio systems for cars, enabling passengers to connect their devices wirelessly and enjoy music or other audio content during journeys.5. Audio streaming dongles: These integrated circuit chips can be used in USB dongles that enable audio streaming from devices without built-in wireless capabilities. Users can plug the dongle into a USB port and transmit audio wirelessly to compatible audio receivers or speakers.Overall, the USB5807-I/KD chips offer several advantages, including their compactness, USB interface, stable transmission, power efficiency, and ease of implementation. These qualities make them suitable for numerous wireless audio applications.
USB5807-I/KD Relevant information