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PI7C9X1170BBLEX

PI7C9X1170BBLEX

Manufacturer No:

PI7C9X1170BBLEX

Manufacturer:

Diodes Incorporated

Description:

IC BRIDGE I2C/SPI TO UART

Datasheet:

Datasheet

Delivery:

Payment:

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PI7C9X1170BBLEX Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    3mA
  • Voltage - Supply
    1.8V, 2.5V, 3.3V
  • Standards
    -
  • Interface
    UART
  • Function
    Bridge, I²C/SPI to UART
  • Protocol
    I²C
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The PI7C9X1170BBLEX is a specific model of integrated circuit chip manufactured by Diodes Incorporated. It is a PCIe-to-USB 3.0 bridge chip, which means it provides a bridge between the PCI Express (PCIe) interface and the USB 3.0 interface. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed data transfer: The PI7C9X1170BBLEX chip supports USB 3.0, which offers significantly faster data transfer rates compared to USB 2.0. This allows for faster file transfers, improved performance for external storage devices, and quicker data backups.2. Compatibility: The chip is designed to be compatible with various operating systems, including Windows, macOS, and Linux. This makes it suitable for a wide range of applications and ensures seamless integration with different platforms.3. Power efficiency: The chip incorporates power management features, such as USB selective suspend and dynamic power management, which help optimize power consumption. This is particularly useful for portable devices where power efficiency is crucial for extending battery life.4. Compact form factor: The PI7C9X1170BBLEX chip is available in a small form factor, making it suitable for integration into space-constrained devices. Its compact size allows for easy integration into various applications without occupying much board space.Application scenarios: 1. External storage devices: The chip can be used in external hard drives, solid-state drives (SSDs), or USB flash drives to enable high-speed data transfer over USB 3.0. This allows users to quickly transfer large files or perform backups efficiently.2. Docking stations: The chip can be utilized in docking stations or hubs to provide USB 3.0 connectivity to laptops or desktops that lack native USB 3.0 ports. This enables users to connect multiple USB 3.0 devices simultaneously and take advantage of the faster data transfer speeds.3. Industrial applications: The chip's robust design and compatibility with various operating systems make it suitable for industrial applications. It can be used in industrial PCs, embedded systems, or automation equipment to provide PCIe-to-USB 3.0 bridging capabilities.4. Consumer electronics: The chip can be integrated into various consumer electronic devices, such as smart TVs, gaming consoles, or set-top boxes, to enable USB 3.0 connectivity. This allows for faster data transfer between these devices and external peripherals like cameras, storage devices, or input devices.Overall, the PI7C9X1170BBLEX chip offers high-speed data transfer, compatibility, power efficiency, and a compact form factor, making it suitable for a wide range of applications in both industrial and consumer electronics domains.
PI7C9X1170BBLEX Relevant information