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BCM68280GSC02

BCM68280GSC02

Manufacturer No:

BCM68280GSC02

Manufacturer:

Broadcom Limited

Description:

EPON HGW W 4X GE AND WIFI

Datasheet:

Datasheet

Delivery:

Payment:

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BCM68280GSC02 Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    -
  • Function
    -
  • Protocol
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    *
The BCM68280GSC02 integrated circuit chips, also known as the Broadcom Tomahawk 3, are advanced Ethernet switch chips designed for high-performance data center and cloud networking applications. Some of the advantages and application scenarios of these chips include:1. High Performance: The BCM68280GSC02 chips offer high-speed switching capabilities, supporting up to 12.8 Terabits per second (Tbps) of bandwidth. This makes them suitable for demanding networking environments that require massive data throughput.2. Scalability: These chips are designed to be highly scalable, allowing for the creation of large-scale data center networks. They support a large number of ports and can be used in various network topologies, including leaf-spine architectures.3. Low Latency: The BCM68280GSC02 chips provide low-latency switching, which is crucial for real-time applications and services that require minimal delay, such as financial trading, high-frequency trading, and real-time analytics.4. Energy Efficiency: Broadcom has incorporated advanced power management features into these chips, making them energy-efficient. This is important for data centers and cloud environments that require high-performance networking while minimizing power consumption.5. Advanced Features: The BCM68280GSC02 chips support a range of advanced features, including deep packet inspection, quality of service (QoS) mechanisms, virtualization support, and network telemetry. These features enable enhanced network management, security, and performance optimization.6. Cloud and Data Center Networking: These chips are specifically designed for cloud and data center networking applications. They can be used in switches and routers to build high-performance, scalable, and reliable networks for cloud service providers, large enterprises, and hyperscale data centers.7. High-Density Switching: The BCM68280GSC02 chips offer high-density switching capabilities, allowing for the consolidation of multiple network devices into a single switch. This reduces the complexity and cost of network infrastructure while improving manageability.8. Software-Defined Networking (SDN): These chips are compatible with SDN architectures, enabling programmability and flexibility in network management. They can be integrated with SDN controllers and orchestration platforms to provide centralized control and automation of network operations.Overall, the BCM68280GSC02 integrated circuit chips provide high-performance, scalable, and energy-efficient solutions for data center and cloud networking applications, making them suitable for a wide range of scenarios where high-speed, low-latency, and reliable networking is required.
BCM68280GSC02 Relevant information