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BCM56851PA2IFSBG

BCM56851PA2IFSBG

Manufacturer No:

BCM56851PA2IFSBG

Manufacturer:

Broadcom Limited

Description:

10G MULTI LAYER SWITCH

Datasheet:

Datasheet

Delivery:

Payment:

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BCM56851PA2IFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    -
  • Function
    -
  • Protocol
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    *
The BCM56851PA2IFSBG is a specific integrated circuit chip manufactured by Broadcom. As an AI language model, I don't have access to real-time information or specific details about the latest products released after my training date in March 2023. Therefore, I cannot provide you with the advantages and application scenarios of the BCM56851PA2IFSBG chip specifically.However, in general, integrated circuit chips like Broadcom's products are used in a wide range of applications, including networking, telecommunications, data centers, and consumer electronics. These chips often offer advantages such as high performance, low power consumption, compact size, and advanced features tailored to specific applications.To learn about the specific advantages and application scenarios of the BCM56851PA2IFSBG chip, I recommend referring to the official documentation, datasheets, or contacting Broadcom directly for the most up-to-date and accurate information.
BCM56851PA2IFSBG Relevant information