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BCM56850A1KFSBG

BCM56850A1KFSBG

Manufacturer No:

BCM56850A1KFSBG

Manufacturer:

Broadcom Limited

Description:

10G MULTI LAYER SWITCH

Datasheet:

Datasheet

Delivery:

Payment:

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BCM56850A1KFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    -
  • Function
    -
  • Protocol
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    *
The BCM56850A1KFSBG is a high-performance integrated circuit chip developed by Broadcom for Ethernet switch applications. It offers several advantages and finds application in various scenarios. Some of them are:Advantages: 1. High performance: The chip supports 10/25/40/50/100 Gigabit Ethernet (GbE) speeds, providing high-speed data transfer rates for demanding network applications. 2. Dense port connectivity: It supports 128 ports of 10/25GbE, 64 ports of 50GbE, or 32 ports of 100GbE, allowing for high-density network deployments. 3. Advanced features: The chip includes advanced features like deep buffering, QoS enhancements, and integrated traffic management. These features ensure efficient data routing and optimal network performance. 4. Energy efficiency: It incorporates energy-efficient Ethernet (EEE) and low-power consumption features, reducing power consumption and operating costs. 5. High scalability: The chip can be used in various network switch configurations, enabling high scalability and flexibility in network designs.Application scenarios: 1. Data centers: The BCM56850A1KFSBG chip is designed for high-speed data center networks. Its high-performance capabilities and dense port connectivity make it suitable for handling heavy data traffic and meeting the bandwidth demands of large-scale data centers. 2. Enterprise networks: The chip can be deployed in the core or distribution layers of enterprise networks, providing high-speed connectivity and efficient switching for various devices. 3. Service provider networks: The chip's high-density port support and advanced features make it suitable for carrier-grade switch applications, meeting the demands of service provider networks with high traffic loads. 4. Cloud computing: The chip's scalability and high-performance features make it suitable for cloud computing infrastructure, where large amounts of data need to be transferred quickly and efficiently. 5. High-performance computing: The chip can be used in high-performance computing environments, such as scientific research or financial institutions, where low-latency and high-bandwidth networks are crucial for processing data-intensive tasks.Overall, the BCM56850A1KFSBG integrated circuit chip offers high-performance capabilities, dense port connectivity, and advanced features, making it suitable for various network deployment scenarios, including data centers, enterprises, service providers, cloud computing, and high-performance computing environments.
BCM56850A1KFSBG Relevant information