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BCM56580A0KFEBG

BCM56580A0KFEBG

Manufacturer No:

BCM56580A0KFEBG

Manufacturer:

Broadcom Limited

Description:

2.5-GIGABIT ETHERNET MULTI-LAY

Datasheet:

Datasheet

Delivery:

Payment:

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BCM56580A0KFEBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    -
  • Function
    -
  • Protocol
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    *
The BCM56580A0KFEBG is an integrated circuit chip developed by Broadcom Limited, which offers several advantages and is suitable for various application scenarios. Some of its key advantages and application scenarios include:1. High-performance Networking: The BCM56580A0KFEBG chip provides high-density 10GbE and 40GbE switching capabilities, enabling high-performance networking solutions for data centers, enterprise networks, and service provider networks.2. Scalability: The chip supports up to 32 ports of 40GbE or 130 ports of 10GbE, providing scalability to meet the increasing demands of large-scale networks.3. Energy Efficiency: The BCM56580A0KFEBG chip incorporates advanced energy-saving features like Energy Efficient Ethernet (EEE) and Broadcom FastLink technology, optimizing power consumption and reducing operating costs.4. Integrated Management: The chip has comprehensive integrated management capabilities, including support for industry-standard protocols like SNMP and CLI, enabling efficient network management and monitoring.5. Virtualization Support: The chip is designed to support virtualized network environments with features like Virtual Ethernet Bridging (VEB) and Virtual Router Redundancy Protocol (VRRP), facilitating the deployment and management of virtualized network functions.6. Data Center Networking: The chip is ideal for data center networking applications, providing high-speed switching, low-latency performance, and advanced Ethernet fabric capabilities required for modern data centers.7. Cloud Computing: With its high-density and scalability, the chip can support cloud computing environments, delivering high-speed connectivity, efficient resource allocation, and optimized network performance for cloud infrastructure.8. Service Provider Networks: The chip is suitable for service provider networks, offering carrier-grade Ethernet services, advanced QoS capabilities, and flexible traffic engineering features necessary for delivering reliable, high-bandwidth services.Overall, the BCM56580A0KFEBG integrated circuit chip combines high-performance networking, scalability, energy efficiency, and advanced management capabilities, making it a versatile solution for various networking applications, including data centers, cloud computing, and service provider networks.
BCM56580A0KFEBG Relevant information