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BCM56324A0KFEBG

BCM56324A0KFEBG

Manufacturer No:

BCM56324A0KFEBG

Manufacturer:

Broadcom Limited

Description:

24-PORT GIGABIT ETHERNET MULTI

Datasheet:

Datasheet

Delivery:

Payment:

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BCM56324A0KFEBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    -
  • Function
    -
  • Protocol
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    *
The BCM56324A0KFEBG is a highly integrated Ethernet switch chip developed by Broadcom. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the BCM56324A0KFEBG integrated circuit chips are:Advantages: 1. High Port Density: The chip supports up to 24 Gigabit Ethernet ports, allowing for a high density of network connections in a single device. 2. Advanced Switching Features: It provides advanced switching features like VLAN (Virtual Local Area Network) support, Quality of Service (QoS) prioritization, and multicast support, enabling efficient and flexible network management. 3. High Performance: The chip offers high-performance switching capabilities with low latency, ensuring fast and reliable data transmission. 4. Power Efficiency: It incorporates power-saving features like Energy Efficient Ethernet (EEE) and low-power idle modes, reducing power consumption and contributing to energy-efficient network infrastructure. 5. Scalability: The chip supports stacking, allowing multiple switches to be interconnected and managed as a single logical unit, providing scalability for expanding network requirements.Application Scenarios: 1. Enterprise Networks: The BCM56324A0KFEBG chip can be used in enterprise networks to build high-performance and scalable Ethernet switches. It enables efficient traffic management, VLAN segmentation, and QoS prioritization, ensuring reliable and secure network connectivity for various applications. 2. Data Centers: With its high port density and advanced features, the chip is suitable for data center environments. It can be used to build top-of-rack switches, providing high-speed connectivity for servers and storage devices, and facilitating efficient data transfer within the data center network. 3. Service Provider Networks: The chip can be utilized in service provider networks to build carrier-grade Ethernet switches. It enables the delivery of high-bandwidth services, supports multicast traffic for IPTV or video streaming, and offers advanced features for network management and security. 4. Campus Networks: The chip can be deployed in campus networks, connecting multiple buildings or departments. It provides high-speed connectivity, VLAN support for network segmentation, and QoS prioritization for different types of traffic, ensuring efficient and reliable communication within the campus environment.Overall, the BCM56324A0KFEBG integrated circuit chips offer high performance, advanced features, and scalability, making them suitable for various networking applications in enterprise, data center, service provider, and campus environments.
BCM56324A0KFEBG Relevant information