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BCM56025B0IPBG

BCM56025B0IPBG

Manufacturer No:

BCM56025B0IPBG

Manufacturer:

Broadcom Limited

Description:

24 PORT FE MULTI LAYER SWITCH

Datasheet:

Datasheet

Delivery:

Payment:

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BCM56025B0IPBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    -
  • Function
    -
  • Protocol
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    *
The BCM56025B0IPBG is a specific model of integrated circuit chip developed by Broadcom. It is a highly integrated Ethernet switch chip designed for use in various networking applications. Some of the advantages and application scenarios of the BCM56025B0IPBG chip are:1. High Port Density: The chip supports up to 24 ports, allowing for the creation of high-density network switches. This makes it suitable for use in data centers, enterprise networks, and service provider networks where a large number of ports are required.2. Gigabit Ethernet Support: The chip supports Gigabit Ethernet speeds, enabling fast and reliable data transfer rates. This is beneficial in scenarios where high bandwidth is required, such as video streaming, file transfers, and data-intensive applications.3. Advanced Features: The BCM56025B0IPBG chip incorporates advanced features like VLAN (Virtual Local Area Network) support, Quality of Service (QoS) capabilities, and security features like Access Control Lists (ACLs). These features enhance network performance, improve traffic management, and ensure data security.4. Power Efficiency: The chip is designed to be power-efficient, consuming low power while delivering high performance. This is advantageous in scenarios where energy consumption is a concern, such as in data centers or environments where multiple switches are deployed.5. Scalability: The chip supports stacking, allowing multiple switches to be interconnected and managed as a single logical unit. This enables easy scalability and expansion of network infrastructure as the demand grows.6. Application Scenarios: The BCM56025B0IPBG chip can be used in various networking scenarios, including data centers, enterprise networks, campus networks, and service provider networks. It is suitable for building high-performance switches, routers, and other network equipment.Overall, the BCM56025B0IPBG chip offers high port density, Gigabit Ethernet support, advanced features, power efficiency, scalability, and can be applied in various networking scenarios, making it a versatile solution for building robust and efficient network infrastructure.
BCM56025B0IPBG Relevant information