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BCM56024B0KPBG

BCM56024B0KPBG

Manufacturer No:

BCM56024B0KPBG

Manufacturer:

Broadcom Limited

Description:

24 PORT FE MULTI LAYER SWITCH

Datasheet:

Datasheet

Delivery:

Payment:

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BCM56024B0KPBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    -
  • Function
    -
  • Protocol
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The BCM56024B0KPBG is a highly integrated Ethernet switch chip developed by Broadcom. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the BCM56024B0KPBG integrated circuit chips are:Advantages: 1. High Port Density: The chip supports up to 24 ports, allowing for a large number of devices to be connected simultaneously. 2. High Performance: It provides high-speed switching capabilities, enabling fast data transfer rates and low latency. 3. Power Efficiency: The chip is designed to be power-efficient, reducing energy consumption and heat generation. 4. Advanced Features: It supports advanced features like Quality of Service (QoS), VLAN tagging, and multicast support, enhancing network management and performance. 5. Scalability: The chip can be used in various network sizes, from small office networks to large enterprise networks.Application Scenarios: 1. Enterprise Networks: The BCM56024B0KPBG chip can be used in enterprise networks to connect multiple devices, such as computers, servers, printers, and IP phones. Its high port density and advanced features make it suitable for managing and optimizing network traffic in large organizations. 2. Data Centers: In data centers, where high-speed data transfer and low latency are crucial, the chip can be used to build high-performance network switches. Its power efficiency also helps in reducing energy costs in these environments. 3. Campus Networks: The chip can be utilized in campus networks to connect various buildings and departments. Its scalability allows for easy expansion as the network grows, and its advanced features enable efficient traffic management. 4. Internet Service Providers (ISPs): ISPs can use the BCM56024B0KPBG chip in their network infrastructure to provide high-speed and reliable internet connectivity to their customers. Its advanced features like QoS and VLAN tagging help in delivering quality services to different user groups. 5. Smart Homes and IoT: With the increasing number of connected devices in smart homes and IoT applications, the chip can be used to build switches that can handle the network traffic efficiently. Its power efficiency is beneficial in reducing energy consumption in these environments.Overall, the BCM56024B0KPBG integrated circuit chip offers high performance, advanced features, and scalability, making it suitable for various networking applications.
BCM56024B0KPBG Relevant information