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BCM55524B1KFSBG

BCM55524B1KFSBG

Manufacturer No:

BCM55524B1KFSBG

Manufacturer:

Broadcom Limited

Description:

IC BCM55524 EPON OLT ASIC LEAD F

Datasheet:

Datasheet

Delivery:

Payment:

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BCM55524B1KFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    -
  • Function
    -
  • Protocol
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    *
The BCM55524B1KFSBG integrated circuit chips, also known as the Broadcom StrataDNX series, offer several advantages and application scenarios:1. High Performance: These chips deliver high-performance packet processing capabilities, allowing for efficient data transfer and handling in networking applications.2. Scalability: The StrataDNX series supports a highly scalable architecture, making it suitable for applications ranging from small enterprise networks to large-scale service provider networks.3. Power Efficiency: These chips are designed to provide high performance while minimizing power consumption, making them ideal for energy-efficient networking systems.4. Integrated Features: The BCM55524B1KFSBG chips come with integrated features such as traffic management, deep packet inspection, and security functionalities, eliminating the need for additional components and reducing system complexity.5. Flexibility and Customization: The StrataDNX series provides flexibility and customization options, enabling network engineers and system integrators to tailor the chips to specific application requirements.Application Scenarios:1. Enterprise Networks: The BCM55524B1KFSBG chips can be used in enterprise networks to support high-speed switching, routing, and security capabilities, ensuring reliable and efficient data transmission for businesses.2. Data Centers: The high-performance packet processing and traffic management features of these chips make them suitable for use in data center switches and routers, enabling efficient data handling and low-latency communication.3. Service Provider Networks: Telecom operators and service providers can deploy StrataDNX chips to build high-capacity and scalable networking equipment for delivering services such as broadband, video streaming, and cloud computing.4. Carrier Ethernet Networks: With its advanced features and scalability, the StrataDNX series is well-suited for carrier Ethernet networks, enabling service providers to offer high-bandwidth, reliable, and secure connectivity to their customers.5. Wireless Infrastructure: These chips can also be utilized in wireless infrastructure equipment like base stations, providing advanced packet processing capabilities and helping meet the ever-increasing demands of mobile networks.Overall, the BCM55524B1KFSBG integrated circuit chips provide high performance, scalability, power efficiency, and integrated features that cater to various networking applications, making them a suitable choice for a range of network infrastructure needs.
BCM55524B1KFSBG Relevant information