BCM53344A0KFSBG

BCM53344A0KFSBG

Manufacturer No:

BCM53344A0KFSBG

Manufacturer:

Broadcom Limited

Description:

24-PORT GE SWITCH (4) GE OR (2)

Datasheet:

Datasheet

Delivery:

Payment:

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BCM53344A0KFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    -
  • Function
    -
  • Protocol
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The BCM53344A0KFSBG is a highly integrated Ethernet switch chip developed by Broadcom. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the BCM53344A0KFSBG integrated circuit chips are:Advantages: 1. High Integration: The chip integrates multiple Ethernet switch functions into a single device, reducing the need for external components and simplifying the overall system design. 2. High Performance: It supports high-speed data transmission with up to 48 Gigabit Ethernet ports, enabling efficient and reliable network connectivity. 3. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for applications where energy consumption is a concern. 4. Advanced Features: It incorporates advanced features like VLAN (Virtual Local Area Network) support, Quality of Service (QoS) management, and security mechanisms, enhancing network performance and security. 5. Scalability: The chip supports stacking, allowing multiple switches to be interconnected and managed as a single unit, providing scalability for expanding network infrastructure.Application Scenarios: 1. Enterprise Networks: The BCM53344A0KFSBG chip can be used in enterprise networks to build high-performance and scalable Ethernet switches. It enables efficient data transmission, VLAN segmentation for network isolation, and QoS management for prioritizing critical traffic. 2. Data Centers: In data center environments, the chip can be utilized to create high-density and low-latency switches. It supports features like link aggregation, which combines multiple physical connections into a single logical link, increasing bandwidth and redundancy. 3. Campus Networks: The chip can be employed in campus networks to connect various devices like computers, printers, and IP phones. It enables efficient traffic management, security features, and simplified network management. 4. Service Provider Networks: The chip can be used in service provider networks to build carrier-grade Ethernet switches. It supports advanced features like MPLS (Multiprotocol Label Switching) and QoS, ensuring reliable and efficient service delivery.Overall, the BCM53344A0KFSBG integrated circuit chips offer high integration, performance, and advanced features, making them suitable for various networking applications in enterprise, data center, campus, and service provider environments.