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BCM53262MKPB

BCM53262MKPB

Manufacturer No:

BCM53262MKPB

Manufacturer:

Broadcom Limited

Description:

MANAGED GE SWITCH

Datasheet:

Datasheet

Delivery:

Payment:

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BCM53262MKPB Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    -
  • Function
    -
  • Protocol
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    *
The BCM53262MKPB is a highly integrated Ethernet switch chip developed by Broadcom. It offers several advantages and can be applied in various scenarios:1. High Port Density: The BCM53262MKPB supports up to 26 ports, including 24 Fast Ethernet (FE) ports and 2 Gigabit Ethernet (GE) ports. This high port density makes it suitable for applications requiring multiple network connections.2. Power over Ethernet (PoE) Support: The chip provides PoE capabilities, allowing it to power devices such as IP phones, wireless access points, and security cameras over the Ethernet connection. This feature is beneficial in scenarios where power outlets are limited or difficult to access.3. Advanced Switching Features: The BCM53262MKPB supports various advanced switching features like VLAN (Virtual Local Area Network) tagging, Quality of Service (QoS) prioritization, and Spanning Tree Protocol (STP). These features enable efficient network management, traffic prioritization, and redundancy, making it suitable for enterprise and industrial applications.4. Energy Efficiency: The chip incorporates energy-saving features like Energy Efficient Ethernet (EEE) and Smart Power Management. These features help reduce power consumption during periods of low network activity, making it environmentally friendly and cost-effective.5. Industrial Temperature Range: The BCM53262MKPB is designed to operate reliably in industrial temperature ranges (-40°C to +85°C). This makes it suitable for deployment in harsh environments, such as industrial automation, transportation, and outdoor networking applications.6. Scalability and Flexibility: The chip supports various network topologies, including standalone, cascaded, and stacked configurations. This scalability and flexibility make it suitable for deployment in different network architectures, ranging from small office networks to large enterprise networks.Overall, the BCM53262MKPB integrated circuit chip offers high port density, PoE support, advanced switching features, energy efficiency, industrial temperature range, and scalability. These advantages make it suitable for a wide range of applications, including enterprise networks, industrial automation, smart buildings, and outdoor networking.
BCM53262MKPB Relevant information