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BCM53262MIPBG

BCM53262MIPBG

Manufacturer No:

BCM53262MIPBG

Manufacturer:

Broadcom Limited

Description:

MANAGED FE SWITCH 24+2

Datasheet:

Datasheet

Delivery:

Payment:

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BCM53262MIPBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    -
  • Function
    -
  • Protocol
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The BCM53262MIPBG is a highly integrated Ethernet switch chip developed by Broadcom. It offers several advantages and can be applied in various scenarios:1. High Integration: The BCM53262MIPBG integrates multiple Ethernet switch functions into a single chip, including 24 Gigabit Ethernet ports, two 10 Gigabit Ethernet uplink ports, and advanced features like VLAN, QoS, and security. This high level of integration reduces the need for additional external components, simplifying the design and reducing costs.2. High Performance: The chip supports wire-speed switching and forwarding, ensuring high-performance data transmission across all ports. It also incorporates advanced traffic management features like flow control, multicast support, and jumbo frame support, enabling efficient handling of network traffic.3. Power Efficiency: The BCM53262MIPBG is designed to be power-efficient, making it suitable for applications where power consumption is a concern. It incorporates features like Energy Efficient Ethernet (EEE) and power-saving modes, which help reduce power consumption during periods of low network activity.4. Scalability: The chip supports stacking, allowing multiple switches to be interconnected and managed as a single logical unit. This enables the creation of larger and more scalable network architectures, suitable for enterprise and data center environments.5. Application Scenarios: The BCM53262MIPBG chip can be used in various scenarios, including: a. Enterprise Networks: It can be used as a core or distribution switch in enterprise networks, providing high-speed connectivity and advanced features for connecting multiple devices and segments. b. Data Centers: The chip's high port density and 10 Gigabit uplink ports make it suitable for use in data center environments, where high-performance and high-bandwidth connectivity is required. c. Service Provider Networks: The chip can be used in service provider networks to build carrier-grade Ethernet switches, providing reliable and scalable connectivity for delivering services to customers. d. Industrial Networks: The chip's power efficiency and advanced features make it suitable for industrial applications, where ruggedness, reliability, and low power consumption are essential.Overall, the BCM53262MIPBG integrated circuit chip offers high integration, performance, power efficiency, and scalability, making it suitable for a wide range of networking applications.
BCM53262MIPBG Relevant information