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BCM88770A1KFSBG

BCM88770A1KFSBG

Manufacturer No:

BCM88770A1KFSBG

Manufacturer:

Broadcom Limited

Description:

144 SERDES MULTI STAGE

Datasheet:

Datasheet

Delivery:

Payment:

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BCM88770A1KFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    Ethernet
  • Function
    Switch
  • Protocol
    Ethernet
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The BCM88770A1KFSBG integrated circuit chip, developed by Broadcom, is a highly integrated solution designed for Gigabit Passive Optical Network (GPON) Optical Line Terminal (OLT) systems. Some advantages of this chip include:1. High Integration: The BCM88770A1KFSBG chip combines multiple functionalities in a single integrated circuit, reducing the need for external components and simplifying the overall system design.2. High Performance: The chip supports up to 4-port Gigabit Ethernet (GbE) interfaces, enabling high-speed data transmission and efficient network connectivity.3. Advanced Features: It provides advanced features such as synchronous Ethernet, dynamic bandwidth allocation, and support for up to 1:128 split ratio, enhancing the capability and flexibility of GPON systems.4. Power Efficiency: The chip is designed to be power-efficient, reducing power consumption and contributing to energy-saving initiatives in network infrastructure.Some application scenarios where the BCM88770A1KFSBG integrated circuit chip can be utilized include:1. Telecommunication Networks: The chip can be used in GPON-based OLT systems deployed in telecommunication networks to provide high-speed internet access, IPTV, video streaming, and other broadband services to residential and business customers.2. Fiber-to-the-Home (FTTH) Deployments: With its support for high-bandwidth connectivity, the chip can be employed in FTTH deployments, enabling the delivery of high-speed internet services directly to customer premises.3. Multi-Dwelling Units (MDUs) and Enterprises: The chip can be used in OLT systems deployed in MDUs or enterprise environments, serving multiple tenants or users within the same building or organization.4. Smart City Infrastructure: As cities implement smart city initiatives, the chip can be utilized in the fiber optic network infrastructure, supporting high-speed communication for various applications such as intelligent transportation systems, smart grids, and public safety.Overall, the BCM88770A1KFSBG integrated circuit chip offers high performance, integration, and advanced features, making it suitable for various GPON-based network deployments.
BCM88770A1KFSBG Relevant information