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BCM53406A0KFSBG

BCM53406A0KFSBG

Manufacturer No:

BCM53406A0KFSBG

Manufacturer:

Broadcom Limited

Description:

12X10G = 12X2.5G SERDES SWITCH

Datasheet:

Datasheet

Delivery:

Payment:

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BCM53406A0KFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    -
  • Function
    -
  • Protocol
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    *
The BCM53406A0KFSBG is a highly integrated Ethernet switch chip developed by Broadcom. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the BCM53406A0KFSBG integrated circuit chips are:Advantages: 1. High Port Density: The chip supports up to 48 Gigabit Ethernet ports, allowing for the creation of high-density switch systems. 2. Power Efficiency: It incorporates advanced power-saving features, such as Energy Efficient Ethernet (EEE) and low-power idle modes, reducing power consumption and operating costs. 3. Advanced Switching Features: The chip supports various advanced switching features like VLANs, QoS, link aggregation, and multicast, enabling efficient network management and traffic control. 4. Scalability: It offers scalability options, allowing for the expansion of network capacity by stacking multiple switches together. 5. Robust Security: The chip includes security features like Access Control Lists (ACLs) and port security, ensuring secure and controlled access to the network.Application Scenarios: 1. Enterprise Networks: The BCM53406A0KFSBG chip can be used in enterprise networks to build high-performance and scalable Ethernet switches. It can handle the demands of large organizations with multiple departments and high data traffic. 2. Data Centers: With its high port density and advanced features, the chip is suitable for data center environments. It can be used to create top-of-rack switches or spine switches in a leaf-spine architecture, providing high-speed connectivity and efficient traffic management. 3. Service Provider Networks: The chip can be utilized in service provider networks to build carrier-grade Ethernet switches. It enables the delivery of high-bandwidth services to customers while ensuring security and quality of service. 4. Industrial Networks: The BCM53406A0KFSBG chip's robustness and power efficiency make it suitable for industrial applications. It can be used in industrial Ethernet switches to provide reliable and secure connectivity in harsh environments. 5. Campus Networks: The chip can be employed in campus networks, such as universities or large educational institutions. It enables the creation of high-density switches to handle the network requirements of a large number of users and devices.Overall, the BCM53406A0KFSBG integrated circuit chips offer high performance, scalability, and advanced features, making them suitable for various networking applications.
BCM53406A0KFSBG Relevant information