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BCM53454A0IFSBG

BCM53454A0IFSBG

Manufacturer No:

BCM53454A0IFSBG

Manufacturer:

Broadcom Limited

Description:

20X2.5G + 4X10G SERDES SWITCH

Datasheet:

Datasheet

Delivery:

Payment:

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BCM53454A0IFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    -
  • Function
    -
  • Protocol
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    *
The BCM53454A0IFSBG is a highly integrated Ethernet switch chip developed by Broadcom. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the BCM53454A0IFSBG integrated circuit chips are:Advantages: 1. High Port Density: The chip supports up to 48 Gigabit Ethernet ports, allowing for the creation of high-density switch systems. 2. Advanced Features: It provides advanced features like VLAN (Virtual Local Area Network) support, Quality of Service (QoS) capabilities, and security features, enabling efficient and secure network management. 3. Power Efficiency: The chip incorporates power-saving technologies, such as Energy Efficient Ethernet (EEE), which reduces power consumption during periods of low network activity. 4. Scalability: It supports stacking, allowing multiple switches to be interconnected and managed as a single logical unit, providing scalability for network expansion. 5. Robust Performance: The chip offers high-performance switching with low latency, ensuring smooth and reliable data transmission.Application Scenarios: 1. Enterprise Networks: The BCM53454A0IFSBG chip can be used in enterprise networks to build high-performance and scalable Ethernet switches. It enables efficient traffic management, VLAN segmentation, and secure access control, meeting the requirements of modern enterprise networks. 2. Data Centers: With its high port density and advanced features, the chip is suitable for data center environments. It can be used to create top-of-rack switches, providing high-speed connectivity and efficient data handling within the data center infrastructure. 3. Service Provider Networks: The chip's scalability and advanced features make it suitable for service provider networks. It can be used in aggregation switches to handle large volumes of traffic, provide QoS for different services, and ensure secure connectivity. 4. Campus Networks: The chip can be utilized in campus networks to build high-density switches for connecting multiple buildings or departments. It enables efficient traffic management, VLAN segmentation, and secure access control, ensuring reliable connectivity within the campus. 5. Industrial Networks: The chip's robust performance and power efficiency make it suitable for industrial networks. It can be used in industrial Ethernet switches to provide reliable and secure connectivity in harsh environments.Overall, the BCM53454A0IFSBG integrated circuit chips offer high port density, advanced features, power efficiency, scalability, and robust performance, making them suitable for various networking applications.
BCM53454A0IFSBG Relevant information