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BCM53456A0IFSBG

BCM53456A0IFSBG

Manufacturer No:

BCM53456A0IFSBG

Manufacturer:

Broadcom Limited

Description:

2XQSGMII + 16X2.5G + 4X10G SERDE

Datasheet:

Datasheet

Delivery:

Payment:

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BCM53456A0IFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    -
  • Function
    -
  • Protocol
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    *
The BCM53456A0IFSBG is a highly integrated Ethernet switch chip developed by Broadcom. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the BCM53456A0IFSBG integrated circuit chips are:Advantages: 1. High Port Density: The chip supports up to 48 Gigabit Ethernet ports, allowing for the creation of large-scale network switches with a high number of ports. 2. Advanced Switching Features: It provides advanced features like VLAN (Virtual Local Area Network) support, Quality of Service (QoS) prioritization, and multicast support, enabling efficient and flexible network management. 3. High Performance: The chip offers high-speed switching capabilities, allowing for fast data transfer rates and low latency, which is crucial in demanding network environments. 4. Power Efficiency: It incorporates power-saving technologies, such as Energy Efficient Ethernet (EEE), to reduce power consumption and promote energy efficiency. 5. Scalability: The chip supports stacking, allowing multiple switches to be interconnected and managed as a single logical unit, providing scalability and simplified management.Application Scenarios: 1. Enterprise Networks: The BCM53456A0IFSBG chip can be used in enterprise networks to build high-performance and scalable Ethernet switches. It enables the creation of large networks with multiple VLANs, QoS prioritization for different applications, and efficient multicast support. 2. Data Centers: In data center environments, where high port density and low latency are crucial, the chip can be used to build top-of-rack switches. These switches provide connectivity for servers and storage devices, ensuring fast and reliable data transfer within the data center infrastructure. 3. Service Provider Networks: The chip can be utilized in service provider networks to build carrier-grade Ethernet switches. These switches can handle high traffic volumes, support advanced features like MPLS (Multiprotocol Label Switching), and provide reliable connectivity for service provider networks. 4. Campus Networks: The chip can be employed in campus networks to build aggregation switches that connect multiple access switches. It enables efficient traffic management, VLAN segmentation, and high-speed connectivity for campus networks. 5. Industrial Networks: The chip's power efficiency and advanced features make it suitable for industrial network applications. It can be used in industrial Ethernet switches to provide reliable and efficient connectivity for industrial automation systems.Overall, the BCM53456A0IFSBG integrated circuit chips offer high port density, advanced features, and power efficiency, making them suitable for various network infrastructure applications.
BCM53456A0IFSBG Relevant information