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BCM53454A0KFSBG

BCM53454A0KFSBG

Manufacturer No:

BCM53454A0KFSBG

Manufacturer:

Broadcom Limited

Description:

20X2.5G + 4X10G SERDES SWITCH

Datasheet:

Datasheet

Delivery:

Payment:

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BCM53454A0KFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    -
  • Function
    -
  • Protocol
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The BCM53454A0KFSBG is a highly integrated Ethernet switch chip developed by Broadcom. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the BCM53454A0KFSBG integrated circuit chips are:Advantages: 1. High Port Density: The chip supports up to 48 Gigabit Ethernet ports, allowing for the creation of high-density switch systems. 2. Advanced Feature Set: It provides advanced features like VLAN, QoS, and security mechanisms, enabling the implementation of complex network configurations. 3. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for energy-conscious applications. 4. High Performance: It offers high-speed switching capabilities, ensuring low latency and fast data transfer rates. 5. Scalability: The chip supports stacking, allowing multiple switches to be interconnected and managed as a single logical unit.Application Scenarios: 1. Enterprise Networks: The BCM53454A0KFSBG chip can be used in enterprise networks to build high-performance and scalable Ethernet switches. It enables the creation of large-scale networks with advanced features like VLANs and QoS for efficient data transmission. 2. Data Centers: With its high port density and low latency, the chip is suitable for data center environments. It can be used to build top-of-rack switches or spine switches, providing high-speed connectivity between servers and storage devices. 3. Service Provider Networks: The chip can be utilized in service provider networks to build carrier-grade Ethernet switches. It enables the delivery of high-bandwidth services to customers while supporting advanced features like MPLS and multicast. 4. Industrial Networks: The BCM53454A0KFSBG chip's low power consumption and robust design make it suitable for industrial applications. It can be used in industrial Ethernet switches to provide reliable and high-performance connectivity in harsh environments. 5. Campus Networks: The chip can be employed in campus networks to build switches for educational institutions or corporate campuses. It enables the creation of scalable networks with advanced security features for secure data transmission.Overall, the BCM53454A0KFSBG integrated circuit chips offer high port density, advanced features, low power consumption, and scalability, making them suitable for various networking applications in enterprise, data center, service provider, industrial, and campus environments.
BCM53454A0KFSBG Relevant information