BCM53456A0KFSBG

BCM53456A0KFSBG

Manufacturer No:

BCM53456A0KFSBG

Manufacturer:

Broadcom Limited

Description:

2XQSGMII + 16X2.5G + 4X10G SERDE

Datasheet:

Datasheet

Delivery:

Payment:

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BCM53456A0KFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    -
  • Function
    -
  • Protocol
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The BCM53456A0KFSBG is a high-density, feature-rich integrated circuit chip developed by Broadcom. It is specifically designed for use in high-performance Ethernet switch systems. Here are some advantages and application scenarios of the BCM53456A0KFSBG IC:Advantages: 1. High-Density: The BCM53456A0KFSBG offers high port density, supporting up to 48 10-Gigabit Ethernet (GbE) or 64 2.5-GbE ports. This allows for the creation of highly scalable and flexible network switch solutions.2. Feature-rich: The chip provides advanced layer 2 and layer 3 switching capabilities, including VLAN, QoS, and multicast support. It also supports various routing protocols, such as OSPFv2, BGP, and VRRP, enabling efficient traffic routing and network management.3. Energy Efficiency: The BCM53456A0KFSBG incorporates energy-saving features, including multiple power modes, intelligent power management, and Energy Efficient Ethernet (EEE) support. This can help reduce power consumption in network infrastructure, resulting in cost savings and improved sustainability.4. Advanced Security: The chip integrates various security features like access control lists, secure management interfaces, and encryption capabilities. It ensures secure access and data transmission, protecting networks from unauthorized access and potential threats.Application Scenarios: 1. Enterprise Networks: The BCM53456A0KFSBG is suitable for building high-performance Ethernet switches in large enterprise networks. It can handle heavy traffic loads and provide advanced network functionalities, ensuring reliable and secure connectivity for multiple users and devices.2. Data Centers: With its high port density and advanced switching capabilities, the chip is well-suited for use in data center switch fabrics. It enables efficient data transfer, network virtualization, and load balancing, which are crucial for handling large volumes of data and supporting cloud computing environments.3. Service Provider Networks: The BCM53456A0KFSBG can be used in carrier-grade Ethernet switches that form the backbone of service provider networks. Its advanced routing protocols and high port count allow for efficient traffic routing, service provisioning, and Quality of Service (QoS) management.4. Wireless Infrastructure: The chip can be utilized in wireless access points and base station switches. It enables high-speed connectivity and seamless handover between multiple wireless devices, supporting the growing demand for wireless connectivity in various environments.Overall, the BCM53456A0KFSBG integrated circuit chip offers high-density, feature-rich capabilities, making it suitable for various networking applications that require scalable, reliable, and secure Ethernet switching solutions.