Home / Controllers / BCM53346A0IFSBLG/
BCM53346A0IFSBLG

BCM53346A0IFSBLG

Manufacturer No:

BCM53346A0IFSBLG

Manufacturer:

Broadcom Limited

Description:

24XGE + 4X10G SMART SWITCH

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

BCM53346A0IFSBLG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Standards
    -
  • Interface
    -
  • Function
    -
  • Protocol
    -
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    *
The BCM53346A0IFSBLG is a highly integrated Ethernet switch chip developed by Broadcom. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the BCM53346A0IFSBLG integrated circuit chips are:Advantages: 1. High Integration: The chip integrates multiple Ethernet switch functions into a single device, reducing the need for external components and simplifying the overall system design. 2. High Performance: It supports high-speed data transmission with up to 48 Gigabit Ethernet ports, enabling efficient and reliable network connectivity. 3. Power Efficiency: The chip is designed to be power-efficient, helping to reduce energy consumption and operating costs. 4. Advanced Features: It offers advanced features like VLAN (Virtual Local Area Network) support, Quality of Service (QoS) management, and security features, enhancing network performance and security. 5. Scalability: The chip supports stacking, allowing multiple switches to be interconnected and managed as a single unit, providing scalability for expanding network requirements.Application Scenarios: 1. Enterprise Networks: The BCM53346A0IFSBLG chip can be used in enterprise networks to build high-performance and scalable Ethernet switches. It enables efficient data transmission, VLAN segmentation, and QoS management, ensuring reliable network connectivity for various applications. 2. Data Centers: In data center environments, where high-speed and reliable network connectivity is crucial, the chip can be used to build switches that provide high-density Gigabit Ethernet ports. It supports features like link aggregation, multicast filtering, and traffic prioritization, optimizing network performance and reducing latency. 3. Campus Networks: The chip can be utilized in campus networks to build switches that connect multiple buildings or departments. It enables VLAN segmentation, security features, and stacking capabilities, providing a flexible and secure network infrastructure for educational institutions or large organizations. 4. Service Provider Networks: The chip can be used in service provider networks to build carrier-grade Ethernet switches. It supports advanced features like MPLS (Multiprotocol Label Switching) and QoS management, ensuring reliable and efficient service delivery for voice, video, and data traffic.Overall, the BCM53346A0IFSBLG integrated circuit chips offer high integration, performance, and advanced features, making them suitable for various network infrastructure applications.
BCM53346A0IFSBLG Relevant information