TEA19051BABTK/1J

TEA19051BABTK/1J

Manufacturer No:

TEA19051BABTK/1J

Manufacturer:

NXP USA Inc.

Description:

IC SMPS CTRLR SMART CHRG HVSON16

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

TEA19051BABTK/1J Specifications

  • Type
    Parameter
  • DigiKey Programmable
    Not Verified
  • Supplier Device Package
    16-HVSON (3.5x5.5)
  • Package / Case
    16-VDFN Exposed Pad
  • Operating Temperature
    -20°C ~ 105°C (TJ)
  • Current - Supply
    3mA
  • Voltage - Supply
    2.9V ~ 21V
  • Standards
    USB 2.0, USB 3.0
  • Interface
    USB
  • Function
    Controller
  • Protocol
    USB
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The MCP2022-330E/P is a specific integrated circuit chip designed by Microchip Technology. It is a LIN (Local Interconnect Network) transceiver, which means it is used for communication in automotive and industrial applications. Here are some advantages and application scenarios of the MCP2022-330E/P:Advantages: 1. LIN Communication: The MCP2022-330E/P chip is specifically designed for LIN communication, which is a widely used protocol in automotive and industrial applications. It provides a reliable and cost-effective solution for communication between various electronic control units (ECUs) in a vehicle or industrial system.2. Low Power Consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered applications. It helps in reducing overall power consumption and extending the battery life of the system.3. Robustness and ESD Protection: The MCP2022-330E/P chip offers robustness against electromagnetic interference (EMI) and electrostatic discharge (ESD). It provides protection against voltage spikes and other disturbances, ensuring reliable communication in harsh environments.4. Small Form Factor: The chip comes in a small form factor package, making it suitable for space-constrained applications. It can be easily integrated into compact electronic systems without occupying much space.Application Scenarios: 1. Automotive Systems: The MCP2022-330E/P chip is commonly used in automotive systems for communication between various ECUs. It can be used in applications such as body control modules, powertrain control modules, lighting control modules, and more.2. Industrial Control Systems: The chip can also be used in industrial control systems where communication between different devices or modules is required. It can be used in applications such as industrial automation, HVAC systems, and building management systems.3. Home Automation: The MCP2022-330E/P chip can be utilized in home automation systems for communication between different smart devices. It enables seamless communication between devices like smart thermostats, lighting control modules, and security systems.4. Medical Devices: The chip can find applications in medical devices that require reliable communication between different modules or sensors. It can be used in applications such as patient monitoring systems, medical imaging devices, and diagnostic equipment.Overall, the MCP2022-330E/P chip offers advantages like LIN communication, low power consumption, robustness, and small form factor, making it suitable for various automotive, industrial, home automation, and medical applications.