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FIDO5210BBCZ

FIDO5210BBCZ

Manufacturer No:

FIDO5210BBCZ

Manufacturer:

Analog Devices Inc.

Description:

REM SWITCH ETHERCAT SOFTWARE

Datasheet:

Datasheet

Delivery:

Payment:

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FIDO5210BBCZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    144-CSPBGA (10x10)
  • Package / Case
    144-LFBGA, CSPBGA
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    48mA
  • Voltage - Supply
    1.08V ~ 1.32V, 2.97V ~ 3.63V
  • Standards
    IEEE 802.3, 10/100 Base-T/TX PHY
  • Interface
    MII, RMII
  • Function
    Switch
  • Protocol
    Ethernet
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
COM2017BIP integrated circuit chips, also known as Communication 2017 Bipolar Integrated Circuit chips, are designed for communication applications. Here are some advantages and application scenarios of these chips:Advantages: 1. High performance: COM2017BIP chips offer high-speed communication capabilities, enabling efficient data transmission and processing. 2. Low power consumption: These chips are designed to consume minimal power, making them suitable for battery-powered devices and energy-efficient applications. 3. Compact size: COM2017BIP chips are compact in size, allowing for integration into small form factor devices and systems. 4. Robustness: These chips are designed to withstand harsh environmental conditions, ensuring reliable communication in various scenarios. 5. Cost-effective: COM2017BIP chips offer a cost-effective solution for communication applications, making them suitable for mass production and deployment.Application scenarios: 1. Wireless communication systems: COM2017BIP chips can be used in wireless communication systems such as Wi-Fi routers, Bluetooth devices, and wireless sensor networks. 2. Internet of Things (IoT): These chips can be integrated into IoT devices for seamless connectivity and communication between devices and the cloud. 3. Telecommunications: COM2017BIP chips can be used in telecommunication infrastructure, including base stations, routers, and switches, to enable high-speed data transmission. 4. Automotive communication: These chips can be utilized in automotive applications for vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communication, enabling advanced driver assistance systems and autonomous driving. 5. Industrial automation: COM2017BIP chips can be employed in industrial automation systems for real-time communication between machines, enabling efficient control and monitoring.Overall, COM2017BIP integrated circuit chips offer high performance, low power consumption, and compact size, making them suitable for various communication applications in different industries.
FIDO5210BBCZ Relevant information