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TP3057WM/63SN

TP3057WM/63SN

Manufacturer No:

TP3057WM/63SN

Manufacturer:

Texas Instruments

Description:

IC CODEC FILTER CMOS 16SOIC

Datasheet:

Datasheet

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Payment:

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TP3057WM/63SN Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -25°C ~ 125°C
  • Voltage - Supply, Digital
    -
  • Voltage - Supply, Analog
    -
  • Dynamic Range, ADCs / DACs (db) Typ
    -
  • S/N Ratio, ADCs / DACs (db) Typ
    -
  • Sigma Delta
    No
  • Number of ADCs / DACs
    1 / 2
  • Resolution (Bits)
    -
  • Data Interface
    PCM
  • Type
    PCM, Filter
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The PEX8764-AB80BI G integrated circuit chips from PLX Technology (now part of Broadcom) belong to the PEX 8700 series of PCIe Gen3 switch chips. These chips are designed to provide high-performance interconnect solutions for various applications. Some of the advantages and application scenarios of the PEX8764-AB80BI G chips are:1. High-performance PCIe Switching: The PEX8764-AB80BI G chips offer PCIe Gen3 switching capabilities, allowing for high-performance data transfer rates between multiple PCIe devices. It supports up to 64 lanes, which can be bifurcated to multiple configurations, offering flexible connectivity options.2. Scalability and Expandability: The PEX8764-AB80BI G chips can be used to create large-scale PCIe-based systems. They support Non-Transparent Bridging (NTB) configurations, enabling multi-host systems with scalability and expandability.3. Low Latency: These chips have low switch latency, which ensures efficient and fast data transfers between PCIe devices. This makes them suitable for applications where low-latency communication is critical, such as high-performance computing, storage systems, or networking solutions.4. Reliable Data Integrity: The PEX8764-AB80BI G chips incorporate advanced error detection and correction mechanisms, ensuring reliable data transmission across PCIe links. They support features such as Advanced Error Reporting (AER) and Link Equalization Training (LEQ), which enhance data integrity.5. Virtualization Support: The PEX8764-AB80BI G chips provide Single-Root I/O Virtualization (SR-IOV) capabilities, allowing for the efficient sharing of PCIe devices across multiple virtual machines. This makes them suitable for server and cloud computing environments where virtualization is essential.6. Data Center Applications: These chips are well-suited for various data center applications, including server connectivity, storage systems, networking solutions, and high-performance computing. They offer reliable and high-bandwidth connectivity options for these demanding environments.7. Storage Systems: The PEX8764-AB80BI G chips can be used in storage systems where fast and reliable data transfers are crucial. They enable high-speed connectivity between storage devices, host controllers, and other PCIe-based components.8. High-End Workstations and Gaming: With their high-performance capabilities, the PEX8764-AB80BI G chips can be used in high-end workstations and gaming systems. They offer fast and efficient data transfers between graphics cards, storage devices, and other components, enhancing overall system performance.Overall, the PEX8764-AB80BI G integrated circuit chips provide a range of advantages such as high-performance PCIe switching, low latency, scalability, and virtualization support. These characteristics make them suitable for various applications, especially in data center environments, storage systems, high-performance computing, and virtualized systems.
TP3057WM/63SN Relevant information