TLV320A3204IRHBRG4

TLV320A3204IRHBRG4

Manufacturer No:

TLV320A3204IRHBRG4

Manufacturer:

Texas Instruments

Description:

IC STEREO AUDIO CODEC 1.8V 32QFN

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

TLV320A3204IRHBRG4 Specifications

  • Type
    Parameter
  • Supplier Device Package
    32-VQFN (5x5)
  • Package / Case
    32-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply, Digital
    1.26V ~ 1.95V
  • Voltage - Supply, Analog
    1.5V ~ 1.95V
  • Dynamic Range, ADCs / DACs (db) Typ
    92 / 100
  • S/N Ratio, ADCs / DACs (db) Typ
    93 / 100
  • Sigma Delta
    Yes
  • Number of ADCs / DACs
    2 / 2
  • Resolution (Bits)
    -
  • Data Interface
    Serial
  • Type
    Stereo Audio
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Discontinued at Digi-Key
  • Series
    -
The PEX8717-CA80BC G integrated circuit chip, manufactured by Broadcom Inc., belongs to the PEX series of switches specifically designed for PCI Express (PCIe) applications. Here are some advantages and application scenarios for this chip:Advantages:1. High Bandwidth: The PEX8717-CA80BC G chip offers a high-speed PCIe Gen3 connection with up to 128 Gbps of bandwidth, enabling fast data transfers between devices.2. Scalability: It supports the Non-Transparent Bridge (NTB) feature, which allows multiple PCIe switches to be connected together, creating scalable and flexible system designs.3. Flexible Configuration: The chip provides various configuration options, including flexible port partitioning, flow control, Quality of Service (QoS), and advanced error handling mechanisms, allowing customization to specific application requirements.4. Low Latency: It offers low-latency performance, making it suitable for latency-sensitive applications such as high-performance computing, data centers, and storage systems.Application Scenarios:1. Data Centers: The PEX8717-CA80BC G chip can be used in data center environments where high-speed and low-latency connectivity is crucial. It enables efficient communication between servers, storage systems, and networking devices within the data center.2. High-Performance Computing (HPC): This chip is well-suited for HPC clusters where fast interconnectivity between compute nodes is essential for parallel processing. Its high bandwidth and low latency characteristics are advantageous in such scenarios.3. Storage Systems: The PEX8717-CA80BC G chip can be utilized in storage systems to facilitate high-speed data transfers between storage devices, RAID controllers, and host systems. Its scalability allows the expansion of storage capacity as required.4. Networking: With its PCIe Gen3 connectivity and configurable features, the chip can be employed in networking equipment such as switches and routers to enable high-performance data transmission and interconnection between devices.Overall, the PEX8717-CA80BC G integrated circuit chip offers advanced PCIe capabilities, making it suitable for various high-bandwidth and low-latency applications in data centers, HPC clusters, storage systems, and networking environments.