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BU8925MUV-E2

BU8925MUV-E2

Manufacturer No:

BU8925MUV-E2

Manufacturer:

Description:

IC PCM CODEC 16BIT 32-VQFN

Datasheet:

Datasheet

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BU8925MUV-E2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    VQFN032V5050
  • Package / Case
    32-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -30°C ~ 85°C (TA)
  • Voltage - Supply, Digital
    1.65V ~ 1.95V
  • Voltage - Supply, Analog
    2.7V ~ 3.47V
  • Dynamic Range, ADCs / DACs (db) Typ
    -
  • S/N Ratio, ADCs / DACs (db) Typ
    -
  • Sigma Delta
    No
  • Number of ADCs / DACs
    1 / 1
  • Resolution (Bits)
    16 b
  • Data Interface
    PCM
  • Type
    PCM
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The PEX8724-CA80BC G is a high-performance, low-latency, and low-power PCI Express (PCIe) switch integrated circuit chip. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the PEX8724-CA80BC G chip are:Advantages: 1. High Performance: The PEX8724-CA80BC G chip provides high-performance PCIe switching capabilities, allowing for efficient data transfer and communication between multiple devices. 2. Low Latency: It offers low-latency switching, ensuring minimal delays in data transmission, which is crucial for real-time applications and high-speed data transfers. 3. Low Power Consumption: The chip is designed to be power-efficient, reducing energy consumption and enabling longer battery life in portable devices. 4. Scalability: The PEX8724-CA80BC G chip supports up to 24 PCIe lanes, allowing for the connection of multiple devices and expansion of the system. 5. Advanced Features: It includes advanced features like Quality of Service (QoS), virtualization support, and error handling mechanisms, enhancing the overall performance and reliability of the PCIe system.Application Scenarios: 1. Data Centers: The PEX8724-CA80BC G chip can be used in data centers to build high-performance and scalable server architectures. It enables efficient communication between servers, storage devices, and networking equipment, facilitating data processing and storage. 2. High-Performance Computing (HPC): In HPC environments, the chip can be utilized to connect multiple GPUs, accelerators, and other high-performance devices. It enables fast data transfers and parallel processing, enhancing the overall performance of HPC systems. 3. Gaming and Graphics: The PEX8724-CA80BC G chip can be employed in gaming consoles, graphics cards, and other gaming devices. It allows for high-speed data transfers between the GPU, memory, and other peripherals, resulting in improved gaming performance and graphics rendering. 4. Network Switches and Routers: The chip can be used in network switches and routers to provide high-speed connectivity between different network devices. It enables efficient data routing and switching, enhancing network performance and reducing latency. 5. Storage Systems: The PEX8724-CA80BC G chip can be integrated into storage systems, such as RAID controllers and storage area networks (SANs). It enables fast data transfers between storage devices, improving the overall storage performance and reliability.Overall, the PEX8724-CA80BC G chip offers high-performance PCIe switching capabilities with low latency and power consumption, making it suitable for various applications requiring efficient data transfer and communication.
BU8925MUV-E2 Relevant information