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TLV320AIC3107IYZFR

TLV320AIC3107IYZFR

Manufacturer No:

TLV320AIC3107IYZFR

Manufacturer:

Texas Instruments

Description:

IC MONO/STER AUD CODEC LP 42-BGA

Datasheet:

Datasheet

Delivery:

Payment:

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TLV320AIC3107IYZFR Specifications

  • Type
    Parameter
  • Supplier Device Package
    42-DSBGA (3.75x3.25)
  • Package / Case
    42-UFBGA, DSBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply, Digital
    1.525V ~ 1.95V
  • Voltage - Supply, Analog
    2.7V ~ 3.6V
  • Dynamic Range, ADCs / DACs (db) Typ
    91 / 92
  • S/N Ratio, ADCs / DACs (db) Typ
    92 / 96
  • Sigma Delta
    Yes
  • Number of ADCs / DACs
    2 / 2
  • Resolution (Bits)
    24 b
  • Data Interface
    I²C, Serial
  • Type
    Stereo Audio
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The LTC2857IDD-2#TRPBF is a specific integrated circuit chip designed by Linear Technology (now part of Analog Devices). It is a low power RS485/RS422 transceiver with integrated ESD protection. Here are some advantages and application scenarios of this chip:Advantages: 1. Low Power Consumption: The LTC2857IDD-2#TRPBF is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 2. Integrated ESD Protection: The chip incorporates built-in electrostatic discharge (ESD) protection, which helps safeguard the circuit from damage due to electrostatic discharge events. 3. Wide Operating Voltage Range: The chip can operate within a wide voltage range, typically from 3V to 5.5V, allowing compatibility with various power supply configurations. 4. High Data Rate: The LTC2857IDD-2#TRPBF supports high-speed data transmission rates up to 20Mbps, making it suitable for applications requiring fast and reliable communication.Application Scenarios: 1. Industrial Automation: The chip can be used in industrial automation systems where reliable and high-speed communication is required between various devices, such as sensors, actuators, and controllers. 2. Building Automation: It can be employed in building automation systems for communication between different subsystems, such as HVAC (heating, ventilation, and air conditioning), lighting control, and security systems. 3. Automotive Electronics: The chip's low power consumption and ESD protection make it suitable for automotive applications, such as in-vehicle networks, infotainment systems, and automotive control modules. 4. Renewable Energy Systems: The LTC2857IDD-2#TRPBF can be used in renewable energy systems, such as solar power plants or wind farms, for communication between monitoring devices, inverters, and control systems. 5. Medical Devices: It can be utilized in medical devices and equipment for reliable and high-speed communication between different components, such as sensors, monitors, and control units.These are just a few examples of the advantages and application scenarios of the LTC2857IDD-2#TRPBF integrated circuit chip. The actual implementation and suitability of the chip depend on the specific requirements and design considerations of the target application.
TLV320AIC3107IYZFR Relevant information