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TLV320AIC10IPFB

TLV320AIC10IPFB

Manufacturer No:

TLV320AIC10IPFB

Manufacturer:

Texas Instruments

Description:

IC DSP CODEC 22KSPS 48-TQFP

Datasheet:

Datasheet

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Payment:

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TLV320AIC10IPFB Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TQFP (7x7)
  • Package / Case
    48-TQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply, Digital
    3V ~ 5.5V
  • Voltage - Supply, Analog
    3V ~ 5.5V
  • Dynamic Range, ADCs / DACs (db) Typ
    82 / 82
  • S/N Ratio, ADCs / DACs (db) Typ
    87 / 90
  • Sigma Delta
    Yes
  • Number of ADCs / DACs
    1 / 1
  • Resolution (Bits)
    16 b
  • Data Interface
    Serial
  • Type
    General Purpose
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The MAX303MSE/PR+ integrated circuit chips offer several advantages and can be applied in various scenarios:1. Low Power Consumption: These chips are designed to operate with low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial.2. High Precision: The MAX303MSE/PR+ chips provide high precision in measuring and sensing various parameters, such as temperature, pressure, or humidity. This accuracy makes them ideal for applications that require precise measurements.3. Small Form Factor: These chips come in a small form factor, making them suitable for compact devices or applications where space is limited.4. Integrated Features: The MAX303MSE/PR+ chips often come with integrated features like analog-to-digital converters (ADCs), digital-to-analog converters (DACs), or signal conditioning circuits. These integrated features simplify the design process and reduce the need for additional components.5. Wide Range of Applications: These chips can be used in a wide range of applications, including industrial automation, medical devices, environmental monitoring, consumer electronics, and automotive systems. They can be utilized for sensing, monitoring, control, or data acquisition purposes.6. Robustness and Reliability: The MAX303MSE/PR+ chips are designed to be robust and reliable, with built-in protection features against voltage spikes, electromagnetic interference (EMI), or temperature variations. This ensures the longevity and stability of the chips in various operating conditions.Overall, the MAX303MSE/PR+ integrated circuit chips offer advantages such as low power consumption, high precision, small form factor, integrated features, and can be applied in a wide range of scenarios requiring sensing, monitoring, control, or data acquisition.
TLV320AIC10IPFB Relevant information