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PEX8632-BB50RBI F

PEX8632-BB50RBI F

Manufacturer No:

PEX8632-BB50RBI F

Manufacturer:

Broadcom Limited

Description:

PEX8632-BB50RBI F

Datasheet:

Datasheet

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Payment:

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PEX8632-BB50RBI F Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Features
    -
  • -3db Bandwidth
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    -
  • On-State Resistance (Max)
    -
  • Switch Circuit
    -
  • Multiplexer/Demultiplexer Circuit
    -
  • Applications
    -
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    *
The PEX8632-BB50RBI F is a high-performance, low-latency PCI Express Gen3 switch integrated circuit chip. It offers several advantages and can be applied in various scenarios:1. High-performance: The PEX8632-BB50RBI F chip provides high-speed data transfer rates of up to 8 GT/s per lane, enabling efficient communication between multiple devices connected through the PCI Express interface.2. Low-latency: The chip offers low-latency data transfer, ensuring minimal delays in data transmission. This is particularly beneficial in applications that require real-time data processing, such as high-frequency trading, network switches, and data centers.3. Scalability: The PEX8632-BB50RBI F chip supports up to 32 PCI Express lanes, allowing for the connection of multiple devices and expansion cards. This scalability makes it suitable for applications that require a large number of PCIe devices, such as servers and storage systems.4. Advanced features: The chip incorporates advanced features like Non-Transparent Bridging (NTB) and Multi-Root IOV (MR-IOV), which enable efficient sharing of PCIe resources among multiple systems. This makes it ideal for applications that require virtualization and resource sharing, such as cloud computing and virtualized environments.5. Reliability and security: The PEX8632-BB50RBI F chip includes features like Advanced Error Reporting (AER) and End-to-End Data Protection (EDP), ensuring reliable data transmission and error detection. It also supports Secure Boot and Secure Firmware Update, enhancing system security.Application scenarios for the PEX8632-BB50RBI F chip include:1. Data centers: The chip can be used in data center servers and storage systems to provide high-speed and low-latency connectivity between various devices, improving overall system performance.2. Network switches: The PEX8632-BB50RBI F chip can be utilized in network switches to enable fast and reliable data transfer between different network interfaces, enhancing network performance and reducing latency.3. High-frequency trading: The low-latency capabilities of the chip make it suitable for high-frequency trading systems, where real-time data processing and quick response times are critical.4. Cloud computing: The PEX8632-BB50RBI F chip's advanced features like NTB and MR-IOV make it ideal for virtualized environments and cloud computing platforms, enabling efficient resource sharing and virtual machine communication.5. Storage systems: The chip can be used in storage systems to provide high-speed connectivity between storage devices and servers, improving data transfer rates and reducing latency.Overall, the PEX8632-BB50RBI F chip offers high-performance, low-latency, scalability, and advanced features, making it suitable for a wide range of applications that require fast and reliable data transfer over the PCI Express interface.
PEX8632-BB50RBI F Relevant information