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PEX8632-BB50RBC F

PEX8632-BB50RBC F

Manufacturer No:

PEX8632-BB50RBC F

Manufacturer:

Broadcom Limited

Description:

IC PCI EXPRESS SWITCH 676FCBGA

Datasheet:

Datasheet

Delivery:

Payment:

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PEX8632-BB50RBC F Specifications

  • Type
    Parameter
  • Mounting Type
    -
  • Features
    -
  • -3db Bandwidth
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    -
  • On-State Resistance (Max)
    -
  • Switch Circuit
    -
  • Multiplexer/Demultiplexer Circuit
    -
  • Applications
    -
  • Packaging
    Tray
The PEX8632-BB50RBC F is a high-performance PCI Express (PCIe) switch integrated circuit chip. It offers several advantages and can be applied in various scenarios:1. High-performance Switching: The PEX8632-BB50RBC F chip provides high-speed PCIe switching capabilities, allowing for efficient data transfer between multiple devices. It supports up to 32 PCIe lanes, enabling high-bandwidth communication.2. Scalability: This chip supports flexible port configurations, allowing for easy expansion and scalability. It can be used in various system architectures, including servers, storage systems, and networking devices.3. Low Latency: The PEX8632-BB50RBC F chip offers low latency, ensuring fast data transfer and reduced processing time. This makes it suitable for applications that require real-time data processing, such as high-frequency trading or data centers.4. Advanced Features: The chip includes advanced features like Non-Transparent Bridging (NTB) and Multi-Root I/O Virtualization (MR-IOV). NTB enables direct communication between PCIe devices without involving the CPU, improving overall system performance. MR-IOV allows for efficient virtualization of PCIe resources, enabling multiple virtual machines to share a single physical PCIe device.5. High Reliability: The PEX8632-BB50RBC F chip is designed for high reliability and fault tolerance. It includes features like hot-plug support, error detection, and error reporting, ensuring system stability and minimizing downtime.Application Scenarios:1. Data Centers: The PEX8632-BB50RBC F chip can be used in data center servers to provide high-speed PCIe connectivity between various components, such as storage devices, network cards, and accelerators. It enables efficient data transfer and improves overall system performance.2. Storage Systems: This chip can be utilized in storage systems to connect multiple storage devices, such as SSDs or HDDs, to a server. It allows for high-bandwidth data transfer, improving storage performance and reducing latency.3. Networking Devices: The PEX8632-BB50RBC F chip can be integrated into networking devices like switches or routers to enable high-speed PCIe connectivity between different network cards or modules. It facilitates efficient data transfer and enhances network performance.4. Virtualized Environments: In virtualized environments, the PEX8632-BB50RBC F chip can be used to provide PCIe virtualization capabilities. It allows multiple virtual machines to share a single physical PCIe device, optimizing resource utilization and improving overall system efficiency.Overall, the PEX8632-BB50RBC F chip offers high-performance PCIe switching capabilities, scalability, low latency, and advanced features, making it suitable for various applications requiring fast and reliable data transfer.
PEX8632-BB50RBC F Relevant information