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MAX4908ETD+

MAX4908ETD+

Manufacturer No:

MAX4908ETD+

Description:

MAX4908 DUAL 3:1 CLICKLESS AUDIO

Datasheet:

Datasheet

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MAX4908ETD+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-TDFN-EP (3x3)
  • Package / Case
    14-WFDFN Exposed Pad
  • Mounting Type
    -
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Features
    Break-Before-Make, Clickless
  • -3db Bandwidth
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.8V ~ 5.5V
  • On-State Resistance (Max)
    750mOhm
  • Number of Channels
    2
  • Switch Circuit
    SP3T
  • Multiplexer/Demultiplexer Circuit
    3:1
  • Applications
    Audio
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The M2S150TS-FCG1152 is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S150TS-FCG1152:Advantages: 1. Versatility: The M2S150TS-FCG1152 is a highly versatile chip that combines an FPGA (Field-Programmable Gate Array) with a microcontroller subsystem. This allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including a 150K logic element FPGA fabric, a 166 MHz ARM Cortex-M3 processor, programmable analog, and digital peripherals. This integration reduces the need for external components, simplifying the overall system design. 3. Security: The SmartFusion2 family of chips, including the M2S150TS-FCG1152, offers advanced security features such as secure boot, tamper detection, and secure key storage. This makes it suitable for applications that require robust security measures. 4. Low power consumption: The M2S150TS-FCG1152 is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 5. High reliability: Microsemi's SmartFusion2 devices are known for their high reliability and radiation tolerance, making them suitable for applications in harsh environments.Application scenarios: 1. Industrial automation: The M2S150TS-FCG1152 can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Aerospace and defense: The chip's radiation tolerance and security features make it suitable for aerospace and defense applications. It can be used in avionics systems, satellite communication, secure data processing, and more. 3. Internet of Things (IoT): The M2S150TS-FCG1152 can be utilized in IoT applications that require both hardware flexibility and software programmability. It can be used for edge computing, sensor data processing, and connectivity protocols. 4. Medical devices: The chip's low power consumption and security features make it suitable for medical devices such as patient monitoring systems, portable diagnostic equipment, and implantable devices. 5. Communications: The M2S150TS-FCG1152 can be used in communication systems, including wired and wireless networks, where it can handle signal processing, encryption, and protocol implementation.These are just a few examples of the advantages and application scenarios of the M2S150TS-FCG1152 chip. The versatility and integration of the chip make it suitable for a wide range of applications across various industries.
MAX4908ETD+ Relevant information