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TS3DV416DGVR

TS3DV416DGVR

Manufacturer No:

TS3DV416DGVR

Manufacturer:

Texas Instruments

Description:

IC MUX/DEMUX 16X8 48TVSOP

Datasheet:

Datasheet

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TS3DV416DGVR Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TVSOP
  • Package / Case
    48-TFSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Features
    DVI, HDMI
  • -3db Bandwidth
    900MHz
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    3V ~ 3.6V
  • On-State Resistance (Max)
    8Ohm
  • Number of Channels
    1
  • Switch Circuit
    -
  • Multiplexer/Demultiplexer Circuit
    16:8
  • Applications
    Video
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The MCP2022T-500E/SL is a specific integrated circuit (IC) chip manufactured by Microchip Technology. It is primarily designed for use in automotive applications, specifically in the area of LIN (Local Interconnect Network) communication. Here are some advantages and application scenarios of the MCP2022T-500E/SL IC:Advantages: 1. LIN Communication: The MCP2022T-500E/SL chip supports LIN bus communication, which is a widely used standard in the automotive industry. It enables reliable and cost-effective communication between various electronic control units (ECUs) in a vehicle.2. Low Power Consumption: This IC chip is designed to operate with low power consumption, making it suitable for automotive applications where energy efficiency is crucial.3. Robustness: The MCP2022T-500E/SL chip is designed to withstand the harsh automotive environment, including temperature variations, electromagnetic interference (EMI), and voltage fluctuations.4. Integrated Protection Features: The chip incorporates various protection features, such as overvoltage protection, undervoltage lockout, and thermal shutdown, which enhance the reliability and safety of the system.Application Scenarios: 1. Automotive Body Control Modules: The MCP2022T-500E/SL chip can be used in body control modules to facilitate communication between different vehicle systems, such as door locks, windows, lighting, and climate control.2. Automotive Lighting Systems: It can be employed in lighting control modules to enable communication between the central lighting controller and individual light modules, allowing for advanced lighting functionalities and diagnostics.3. Automotive Climate Control Systems: The MCP2022T-500E/SL chip can be utilized in climate control modules to enable communication between the main climate control unit and various sensors and actuators, ensuring efficient and synchronized operation.4. Automotive Seat Control Systems: It can be integrated into seat control modules to enable communication between the seat control unit and various seat components, such as motors, heaters, and position sensors, providing enhanced comfort and adjustability.These are just a few examples of the potential applications and advantages of the MCP2022T-500E/SL IC chip in the automotive industry. Its features and capabilities make it suitable for various communication and control tasks within a vehicle.
TS3DV416DGVR Relevant information