BA7649AF-E2

BA7649AF-E2

Manufacturer No:

BA7649AF-E2

Manufacturer:

Description:

IC MUX 5:1 14SOP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

BA7649AF-E2 Specifications

  • Type
    Parameter
  • Features
    -
  • Number of Channels
    1
  • Switch Circuit
    -
  • Applications
    Video
  • Supplier Device Package
    14-SOP
  • Package / Case
    14-SOIC (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -25°C ~ 75°C
  • -3db Bandwidth
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    4.5V ~ 13V
  • On-State Resistance (Max)
    -
  • Multiplexer/Demultiplexer Circuit
    5:1
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Not For New Designs
  • Series
    -
The MC3235F is a specific integrated circuit (IC) chip manufactured by Motorola. However, there is limited information available about this particular chip, and it is possible that it may be outdated or not widely used anymore. Therefore, it is challenging to provide specific advantages and application scenarios for the MC3235F chip.In general, IC chips are used in a wide range of electronic devices and applications. They provide various advantages, such as:1. Miniaturization: IC chips allow for the integration of multiple electronic components onto a single chip, reducing the size and weight of electronic devices.2. Power efficiency: IC chips are designed to be power-efficient, helping to extend the battery life of portable devices.3. Cost-effectiveness: Mass production of IC chips reduces manufacturing costs, making electronic devices more affordable.4. Reliability: IC chips are designed to be highly reliable, with improved resistance to environmental factors like temperature and humidity.5. Performance: IC chips can provide high-speed processing capabilities, enabling faster and more efficient operation of electronic devices.However, without specific information about the MC3235F chip, it is not possible to provide accurate application scenarios. It is recommended to refer to the datasheet or technical documentation provided by the manufacturer for detailed information about the chip's features, advantages, and potential applications.