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ISL54209IRTZ Specifications
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TypeParameter
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Supplier Device Package10-TDFN (3x3)
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Package / Case10-VFDFN Exposed Pad
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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FeaturesBreak-Before-Make, USB 2.0
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-3db Bandwidth736MHz
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Voltage - Supply, Dual (V±)-
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Voltage - Supply, Single (V+)2.5V ~ 5V
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On-State Resistance (Max)2.8Ohm (Audio), 6.5Ohm (USB)
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Number of Channels2
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Switch CircuitSPDT
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Multiplexer/Demultiplexer Circuit2:1
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ApplicationsAudio, USB
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PackagingTube
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Product StatusObsolete
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Series-
The ISL54209IRTZ is a specific integrated circuit chip, but as an AI language model, I don't have real-time access to the latest product information. However, I can provide you with some general information about integrated circuit chips and their potential advantages and application scenarios.Integrated circuit chips, also known as IC chips or simply ICs, are miniaturized electronic circuits that contain various components such as transistors, resistors, and capacitors. They are widely used in a variety of electronic devices and systems.Advantages of integrated circuit chips can include:1. Miniaturization: IC chips allow for the integration of multiple components onto a single chip, reducing the size and complexity of electronic devices.2. Power efficiency: Integrated circuits are designed to be power-efficient, which can help extend the battery life of portable devices.3. Reliability: IC chips are manufactured using advanced processes, resulting in high reliability and improved performance.4. Cost-effectiveness: Mass production of IC chips can lead to cost savings, making them an economical choice for many applications.As for the specific application scenarios of the ISL54209IRTZ chip, I apologize, but I don't have access to its detailed specifications or application information. To learn more about this chip and its specific advantages and applications, I recommend referring to the manufacturer's documentation, datasheets, or contacting the manufacturer directly.
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