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TS3USB30EDGSR

TS3USB30EDGSR

Manufacturer No:

TS3USB30EDGSR

Manufacturer:

Texas Instruments

Description:

IC USB SWITCH SGL 1X2 10MSOP

Datasheet:

Datasheet

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TS3USB30EDGSR Specifications

  • Type
    Parameter
  • Supplier Device Package
    10-VSSOP
  • Package / Case
    10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Features
    Bi-Directional, USB 2.0
  • -3db Bandwidth
    900MHz
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    3V ~ 4.3V
  • On-State Resistance (Max)
    10Ohm
  • Number of Channels
    1
  • Switch Circuit
    DPDT
  • Multiplexer/Demultiplexer Circuit
    -
  • Applications
    USB
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TS3USB30EDGSR integrated circuit chips offer several advantages and can be applied in various scenarios:1. High-speed data transmission: These chips support high-speed USB 3.0 data rates up to 5Gbps, making them suitable for applications that require fast data transfer, such as external hard drives, USB hubs, and docking stations.2. Low-power consumption: The TS3USB30EDGSR chips have low power consumption, helping to save energy in portable devices and extending battery life.3. Switching capability: They offer multiple USB switch channels, enabling seamless switching between different USB ports or devices. This feature is useful in systems with limited USB ports, allowing users to connect multiple devices and switch between them without physically swapping cables.4. ESD protection: The integrated chips provide built-in Electrostatic Discharge (ESD) protection, safeguarding the connected devices from potential damage caused by power surges or electrostatic discharge.5. Flexibility in circuit design: The TS3USB30EDGSR chips are designed with a small form factor, making them suitable for space-constrained applications. They also have a wide operating voltage range and are compatible with various USB specifications, providing design flexibility to accommodate different system requirements.Application scenarios for TS3USB30EDGSR chips:1. Mobile devices: These integrated chips can be used in smartphones, tablets, and laptops, where they allow users to connect external USB devices like keyboards, mice, or external storage devices.2. Audio/Video systems: The TS3USB30EDGSR chips are utilized in audio/video receivers, gaming consoles, or set-top boxes to manage multiple USB connections for peripherals like USB controllers, video cameras, or media players.3. Automotive systems: They are employed in car infotainment systems to switch between multiple USB devices, enabling features like media playback or connecting smartphones for data transfer.4. Industrial applications: These chips can be used in industrial equipment or automation systems with USB interfaces, providing effective data transmission and protection against ESD.Overall, the TS3USB30EDGSR integrated circuit chips offer a versatile solution for managing USB connections in various electronic devices, ensuring high-speed data transmission, power efficiency, and ESD protection.
TS3USB30EDGSR Relevant information