Home / Digital to Analog Converters (DAC) / TLV5610IYER/
TLV5610IYER

TLV5610IYER

Manufacturer No:

TLV5610IYER

Manufacturer:

Texas Instruments

Description:

IC DAC 12BIT V-OUT DIESALE

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

TLV5610IYER Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    Diesale
  • Package / Case
    Die
  • Operating Temperature
    -40°C ~ 85°C
  • Architecture
    String DAC
  • INL/DNL (LSB)
    ±2, ±0.5
  • Voltage - Supply, Digital
    2.7V ~ 3.3V, 5V
  • Voltage - Supply, Analog
    2.7V ~ 3.3V, 5V
  • Reference Type
    External
  • Data Interface
    SPI
  • Differential Output
    No
  • Output Type
    Voltage - Buffered
  • Settling Time
    7µs
  • Number of D/A Converters
    8
  • Number of Bits
    12
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The AFE7071IRGZR is an integrated circuit chip designed for use in ultrasound imaging applications. It offers several advantages and can be used in various scenarios, including:1. High Performance: The AFE7071IRGZR provides high-performance analog front-end (AFE) functionality, enabling high-resolution and high-quality ultrasound imaging.2. Low Power Consumption: This chip is designed to operate with low power consumption, making it suitable for portable and battery-powered ultrasound devices.3. Integrated Features: The AFE7071IRGZR integrates several features, such as a low-noise amplifier, variable gain amplifier, analog-to-digital converter, and digital beamformer. This integration simplifies the design process and reduces the overall system cost.4. Wide Dynamic Range: The chip offers a wide dynamic range, allowing it to capture and process signals from a wide range of ultrasound frequencies and amplitudes.5. Programmability: The AFE7071IRGZR is programmable, allowing users to configure various parameters and optimize the chip's performance for specific imaging applications.Application scenarios for the AFE7071IRGZR include:1. Medical Ultrasound Imaging: The chip can be used in medical ultrasound imaging systems, enabling high-resolution imaging for diagnostic purposes. It can be integrated into portable ultrasound devices used in clinics, hospitals, or remote areas.2. Industrial Non-Destructive Testing: The AFE7071IRGZR can be utilized in non-destructive testing applications, such as inspecting welds, detecting flaws in materials, or evaluating structural integrity. Its high-performance and programmability make it suitable for demanding industrial environments.3. Veterinary Ultrasound: The chip can be employed in veterinary ultrasound systems for imaging animals. Its low power consumption and high-resolution capabilities make it suitable for portable and handheld devices used by veterinarians in the field.4. Research and Development: The AFE7071IRGZR can be used in research and development projects related to ultrasound imaging. Its programmability allows researchers to experiment with different imaging techniques and optimize the chip's performance for specific research requirements.Overall, the AFE7071IRGZR integrated circuit chip offers high-performance ultrasound imaging capabilities, low power consumption, and programmability, making it suitable for various applications in the medical, industrial, veterinary, and research fields.
TLV5610IYER Relevant information