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DAC7616EB/1KG4

DAC7616EB/1KG4

Manufacturer No:

DAC7616EB/1KG4

Manufacturer:

Texas Instruments

Description:

IC DAC 12BIT V-OUT 20SSOP

Datasheet:

Datasheet

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DAC7616EB/1KG4 Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    20-SSOP
  • Package / Case
    20-SSOP (0.209", 5.30mm Width)
  • Operating Temperature
    -40°C ~ 85°C
  • Architecture
    R-2R
  • INL/DNL (LSB)
    ±1 (Max), ±1 (Max)
  • Voltage - Supply, Digital
    3V ~ 3.6V
  • Voltage - Supply, Analog
    3V ~ 3.6V
  • Reference Type
    External
  • Data Interface
    SPI
  • Differential Output
    No
  • Output Type
    Voltage - Buffered
  • Settling Time
    10µs
  • Number of D/A Converters
    4
  • Number of Bits
    12
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The XCR3256XL-12FT256C is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the XCR3000XL family of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this particular IC chip:Advantages: 1. High Logic Density: The XCR3256XL-12FT256C offers a high logic density, allowing for the implementation of complex digital circuits on a single chip. 2. Flexibility: Being an FPGA, it is highly flexible and can be reprogrammed to perform different functions or adapt to changing requirements. 3. Fast Processing: The chip provides fast processing capabilities, enabling it to handle real-time applications and high-speed data processing. 4. Low Power Consumption: It is designed to consume low power, making it suitable for battery-powered or energy-efficient devices. 5. Integrated Features: The XCR3256XL-12FT256C includes various integrated features like configurable I/O pins, memory blocks, and digital signal processing (DSP) slices, enhancing its versatility.Application Scenarios: 1. Digital Signal Processing: The XCR3256XL-12FT256C can be used in applications that require real-time signal processing, such as audio/video processing, telecommunications, and software-defined radios. 2. Embedded Systems: It is suitable for embedded systems where flexibility and reconfigurability are essential, such as industrial automation, robotics, and automotive electronics. 3. Prototyping and Development: The FPGA chip is commonly used in prototyping and development of digital circuits, allowing engineers to quickly test and iterate their designs before manufacturing custom ASICs (Application-Specific Integrated Circuits). 4. High-Speed Data Processing: With its fast processing capabilities, the XCR3256XL-12FT256C can be utilized in applications that involve high-speed data processing, such as data centers, network switches, and routers. 5. Aerospace and Defense: The chip's reliability, low power consumption, and ability to handle complex algorithms make it suitable for aerospace and defense applications, including avionics, radar systems, and secure communications.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of a particular project.
DAC7616EB/1KG4 Relevant information