AD5453YRM-REEL

AD5453YRM-REEL

Manufacturer No:

AD5453YRM-REEL

Manufacturer:

Analog Devices Inc.

Description:

IC DAC 14BIT A-OUT 8MSOP

Datasheet:

Datasheet

Delivery:

Payment:

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AD5453YRM-REEL Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    8-MSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Operating Temperature
    -40°C ~ 125°C
  • Architecture
    R-2R
  • INL/DNL (LSB)
    ±2 (Max), -1/+2 (Max)
  • Voltage - Supply, Digital
    2.5V ~ 5.5V
  • Voltage - Supply, Analog
    2.5V ~ 5.5V
  • Reference Type
    External
  • Data Interface
    SPI, DSP
  • Differential Output
    No
  • Output Type
    Current - Unbuffered
  • Settling Time
    110ns
  • Number of D/A Converters
    1
  • Number of Bits
    14
  • DigiKey Programmable
    Not Verified
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The XCR3256XL-10FTG256C is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the Xilinx CoolRunner XPLA3 family of complex programmable logic devices (CPLDs). Here are some advantages and application scenarios of the XCR3256XL-10FTG256C IC chips:Advantages: 1. Low power consumption: The CoolRunner XPLA3 family, including the XCR3256XL-10FTG256C, is known for its low power consumption. This makes it suitable for battery-powered devices or applications where power efficiency is crucial. 2. High performance: Despite its low power consumption, the XCR3256XL-10FTG256C offers high performance and fast operation. It can handle complex logic functions and provide efficient solutions for various applications. 3. Flexibility: The XCR3256XL-10FTG256C is a programmable logic device, which means it can be configured and reconfigured to perform different functions. This flexibility allows designers to adapt the chip to their specific requirements without the need for hardware changes. 4. Small form factor: The XCR3256XL-10FTG256C comes in a small footprint package, making it suitable for space-constrained designs or applications where size matters.Application scenarios: 1. Embedded systems: The XCR3256XL-10FTG256C can be used in various embedded systems, such as industrial control systems, automotive electronics, or consumer electronics. Its low power consumption and high performance make it suitable for these applications. 2. Communication devices: The XCR3256XL-10FTG256C can be utilized in communication devices like routers, switches, or network interface cards. Its programmability allows for customization and adaptation to different communication protocols or standards. 3. Test and measurement equipment: The XCR3256XL-10FTG256C can be employed in test and measurement equipment, where its flexibility and high performance can be utilized to implement complex logic functions required for data processing or signal analysis. 4. Medical devices: The low power consumption and small form factor of the XCR3256XL-10FTG256C make it suitable for medical devices that require compact size and long battery life, such as portable medical monitors or diagnostic equipment.These are just a few examples of the advantages and application scenarios of the XCR3256XL-10FTG256C IC chips. The actual implementation and usage depend on the specific requirements and design considerations of the target application.