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MAX5803AUB+

MAX5803AUB+

Manufacturer No:

MAX5803AUB+

Description:

IC DAC 8BIT V-OUT 10UMAX

Datasheet:

Datasheet

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MAX5803AUB+ Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    10-uMAX/uSOP
  • Package / Case
    10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • Operating Temperature
    -40°C ~ 125°C
  • Architecture
    R-2R
  • INL/DNL (LSB)
    ±0.05, ±0.05
  • Voltage - Supply, Digital
    2.7V ~ 5.5V
  • Voltage - Supply, Analog
    2.7V ~ 5.5V
  • Reference Type
    External, Internal
  • Data Interface
    I²C
  • Differential Output
    No
  • Output Type
    Voltage - Buffered
  • Settling Time
    2.8µs (Typ)
  • Number of D/A Converters
    1
  • Number of Bits
    8
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The 5M570ZF256C5N is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this IC chip:Advantages: 1. Versatility: The 5M570ZF256C5N is a highly versatile chip that combines an FPGA (Field-Programmable Gate Array) with a microcontroller subsystem, providing the benefits of both technologies in a single device. 2. Integration: It integrates various components, including programmable logic, microcontroller, memory, and peripherals, reducing the need for external components and simplifying system design. 3. Security: The chip offers advanced security features, such as secure boot, tamper detection, and secure key storage, making it suitable for applications requiring robust security measures. 4. Low power consumption: The SmartFusion2 family of chips, including the 5M570ZF256C5N, is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications. 5. High performance: With its FPGA fabric and ARM Cortex-M3 microcontroller, the chip provides high-performance computing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The 5M570ZF256C5N chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Aerospace and defense: The chip's security features, combined with its high-performance computing capabilities, make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication systems, or military-grade embedded systems. 3. Internet of Things (IoT): The versatility and integration of the chip make it suitable for IoT applications. It can be used in smart home devices, industrial IoT gateways, or edge computing devices, where it can handle data processing, connectivity, and security. 4. Medical devices: The chip's low power consumption, security features, and high-performance computing make it suitable for medical devices. It can be used in patient monitoring systems, medical imaging devices, or portable medical equipment. 5. Automotive: The 5M570ZF256C5N chip can be used in automotive applications, such as advanced driver-assistance systems (ADAS), infotainment systems, or vehicle control units. Its FPGA fabric allows for customization and adaptation to specific automotive requirements.These are just a few examples of the advantages and application scenarios of the 5M570ZF256C5N chip. The actual usage depends on the specific requirements and design considerations of the target application.
MAX5803AUB+ Relevant information