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MX7533LEWE+T

MX7533LEWE+T

Manufacturer No:

MX7533LEWE+T

Description:

IC DAC 10BIT A-OUT 16SOIC

Datasheet:

Datasheet

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MX7533LEWE+T Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.295", 7.50mm Width)
  • Operating Temperature
    -40°C ~ 85°C
  • Architecture
    R-2R
  • INL/DNL (LSB)
    -
  • Voltage - Supply, Digital
    5V ~ 16.5V
  • Voltage - Supply, Analog
    5V ~ 16.5V
  • Reference Type
    External
  • Data Interface
    Parallel
  • Differential Output
    Yes
  • Output Type
    Current - Unbuffered
  • Settling Time
    800ns
  • Number of D/A Converters
    1
  • Number of Bits
    10
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The CY37512P256-100BGI is a specific model of integrated circuit chip manufactured by Cypress Semiconductor. It belongs to the CY375xx family of programmable system-on-chip (PSoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Programmability: The CY37512P256-100BGI is a highly programmable chip, allowing users to configure and customize its functionality according to their specific requirements. 2. Integration: It combines multiple components, including a microcontroller, digital and analog peripherals, and programmable logic, into a single chip. This integration reduces the need for external components and simplifies the overall system design. 3. Flexibility: The chip offers a wide range of configurable digital and analog peripherals, allowing users to tailor the chip's functionality to their application needs. 4. Low power consumption: The CY37512P256-100BGI is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. Cost-effective: The integration of multiple components into a single chip reduces the overall system cost by eliminating the need for additional components and reducing the board space required.Application scenarios: 1. Internet of Things (IoT): The CY37512P256-100BGI can be used in IoT applications where low power consumption, flexibility, and integration are crucial. It can serve as a control hub for various IoT devices, enabling communication, data processing, and sensor interfacing. 2. Industrial automation: The chip's programmability and integration make it suitable for industrial automation applications. It can be used to control and monitor various processes, interface with sensors and actuators, and implement custom control algorithms. 3. Consumer electronics: The CY37512P256-100BGI can be used in various consumer electronic devices, such as smart home devices, wearable devices, and portable gadgets. Its low power consumption and integration make it suitable for battery-powered devices with limited space. 4. Medical devices: The chip's flexibility and integration make it suitable for medical device applications. It can be used in devices such as patient monitors, medical imaging equipment, and diagnostic devices, where customization, low power consumption, and compact size are important. 5. Automotive: The CY37512P256-100BGI can be used in automotive applications, such as vehicle control systems, infotainment systems, and advanced driver-assistance systems (ADAS). Its programmability and integration allow for customization and efficient system design in the automotive environment.It's important to note that the specific application scenarios may vary depending on the requirements and capabilities of the CY37512P256-100BGI chip and the overall system design.
MX7533LEWE+T Relevant information