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HI5760IA-T

HI5760IA-T

Manufacturer No:

HI5760IA-T

Description:

IC DAC 10BIT A-OUT 28TSSOP

Datasheet:

Datasheet

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HI5760IA-T Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    28-TSSOP
  • Package / Case
    28-TSSOP (0.173", 4.40mm Width)
  • Operating Temperature
    -40°C ~ 85°C
  • Architecture
    Current Source
  • INL/DNL (LSB)
    ±0.5, ±0.25
  • Voltage - Supply, Digital
    2.7V ~ 5.5V
  • Voltage - Supply, Analog
    2.7V ~ 5.5V
  • Reference Type
    External, Internal
  • Data Interface
    Parallel
  • Differential Output
    Yes
  • Output Type
    Current - Unbuffered
  • Settling Time
    35ns (Typ)
  • Number of D/A Converters
    1
  • Number of Bits
    10
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The XCR3512XL-12FG324C is an integrated circuit chip from Xilinx, which is a programmable logic device (PLD) belonging to the XC3000 series. Here are some advantages and application scenarios of this chip:Advantages: 1. High-density logic capacity: The XCR3512XL-12FG324C offers a large number of configurable logic blocks (CLBs) and flip-flops, allowing for the implementation of complex digital designs. 2. Flexible programmability: It is a reprogrammable chip, enabling users to modify the functionality of the device even after it has been manufactured. 3. Low power consumption: The chip is designed to operate with low power requirements, making it suitable for power-sensitive applications. 4. Fast performance: It supports high-speed operation, enabling efficient execution of complex logic functions. 5. Wide range of I/O options: The chip provides a variety of input/output options, including general-purpose I/O pins, differential I/O, and high-speed serial interfaces.Application scenarios: 1. Digital signal processing (DSP): The XCR3512XL-12FG324C can be used in DSP applications such as audio and video processing, image recognition, and telecommunications. 2. Embedded systems: It is suitable for implementing complex control and processing functions in embedded systems, including industrial automation, robotics, and automotive electronics. 3. Communication systems: The chip can be utilized in the design of communication systems, such as routers, switches, and network interface cards. 4. Test and measurement equipment: It can be employed in the development of test and measurement devices, including oscilloscopes, logic analyzers, and data acquisition systems. 5. Consumer electronics: The XCR3512XL-12FG324C can be used in various consumer electronic devices, such as gaming consoles, set-top boxes, and multimedia players.It is important to note that the specific application scenarios may vary depending on the requirements and design considerations of the project.
HI5760IA-T Relevant information