AD664SD-BIP

AD664SD-BIP

Manufacturer No:

AD664SD-BIP

Manufacturer:

Analog Devices Inc.

Description:

IC DAC 12BIT V-OUT 28CDIP

Datasheet:

Datasheet

Delivery:

Payment:

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AD664SD-BIP Specifications

  • Type
    Parameter
  • Mounting Type
    Through Hole
  • Supplier Device Package
    28-CDIP
  • Package / Case
    28-CDIP (0.600", 15.24mm)
  • Operating Temperature
    -55°C ~ 125°C
  • Architecture
    R-2R
  • INL/DNL (LSB)
    ±0.75, ±0.75 (Max)
  • Voltage - Supply, Digital
    5V
  • Voltage - Supply, Analog
    ±11.4V ~ 16.5V
  • Reference Type
    External
  • Data Interface
    Parallel
  • Differential Output
    No
  • Output Type
    Voltage - Buffered
  • Settling Time
    10µs
  • Number of D/A Converters
    4
  • Number of Bits
    12
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The XCR3256XL-10FTG256I is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the Xilinx CoolRunner XPLA3 family of CPLDs (Complex Programmable Logic Devices). Here are some advantages and application scenarios of this chip:Advantages: 1. Low power consumption: The CoolRunner XPLA3 family is known for its low power characteristics, making it suitable for battery-powered or power-sensitive applications. 2. High performance: The XCR3256XL-10FTG256I offers fast operation and efficient logic utilization, enabling high-performance designs. 3. In-system programmability: The chip can be programmed and reprogrammed in-circuit, allowing for flexibility and ease of design iteration. 4. High logic capacity: With 256 macrocells, the XCR3256XL-10FTG256I provides a decent amount of logic resources for implementing complex digital designs. 5. Small form factor: The chip comes in a small footprint package, making it suitable for space-constrained designs.Application scenarios: 1. Embedded systems: The XCR3256XL-10FTG256I can be used in various embedded systems, such as industrial control systems, automotive electronics, and consumer electronics, where low power consumption and high performance are desired. 2. Communication devices: It can be utilized in networking equipment, routers, switches, and other communication devices to implement custom logic functions or interface protocols. 3. Test and measurement equipment: The chip can be used in test and measurement instruments to implement signal processing, data acquisition, or control functions. 4. Robotics and automation: It can be employed in robotics and automation systems for control and coordination of various subsystems. 5. Prototyping and development: The XCR3256XL-10FTG256I can be used in prototyping and development boards to quickly implement and test digital logic designs.It's important to note that the specific application scenarios may vary depending on the requirements and design goals of a particular project.