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MAX5733BUTN+

MAX5733BUTN+

Manufacturer No:

MAX5733BUTN+

Description:

IC DAC 16BIT 32CHAN SER 56-TQFN

Datasheet:

Datasheet

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MAX5733BUTN+ Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    56-TQFN (8x8)
  • Package / Case
    56-WFQFN Exposed Pad
  • Operating Temperature
    0°C ~ 85°C
  • Architecture
    Pipelined
  • INL/DNL (LSB)
    ±8, ±1 (Max)
  • Voltage - Supply, Digital
    2.7V ~ 5.25V
  • Voltage - Supply, Analog
    5V
  • Reference Type
    External
  • Data Interface
    SPI, DSP
  • Differential Output
    No
  • Output Type
    Voltage - Buffered
  • Settling Time
    20µs (Typ)
  • Number of D/A Converters
    32
  • Number of Bits
    16
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The 5M570ZF256C4N is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this IC chip:Advantages: 1. Versatility: The 5M570ZF256C4N is a highly versatile chip that combines an FPGA (Field-Programmable Gate Array) with a microcontroller subsystem. This allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including a 166 MHz ARM Cortex-M3 processor, programmable logic fabric, memory, and peripherals. This integration reduces the need for external components, simplifying the overall system design and reducing costs. 3. Security: The SmartFusion2 family of chips, including the 5M570ZF256C4N, offers advanced security features such as secure boot, tamper detection, and secure key storage. This makes it suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: With its FPGA fabric and ARM Cortex-M3 processor, the chip offers high-performance computing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The 5M570ZF256C4N chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and real-time monitoring. Its flexibility allows for customization to specific industrial requirements. 2. Internet of Things (IoT): The chip's combination of FPGA and microcontroller capabilities makes it suitable for IoT applications. It can be used for edge computing, data processing, and connectivity in IoT devices. 3. Aerospace and defense: The chip's security features, low power consumption, and high performance make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, and military equipment. 4. Medical devices: The chip's versatility and security features make it suitable for medical devices that require customization, real-time processing, and data security. 5. Communications: The chip can be used in communication systems, such as routers, switches, and network appliances, where its FPGA fabric can be utilized for protocol processing and its microcontroller subsystem for control and management functions.These are just a few examples of the advantages and application scenarios of the 5M570ZF256C4N IC chip. The specific usage depends on the requirements and needs of the application.
MAX5733BUTN+ Relevant information