LTC1599BIN#PBF
Manufacturer No:
LTC1599BIN#PBF
Manufacturer:
Description:
IC DAC 16BIT A-OUT 24DIP
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In Stock : 0
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LTC1599BIN#PBF Specifications
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TypeParameter
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Mounting TypeThrough Hole
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Supplier Device Package24-PDIP
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Package / Case24-DIP (0.300", 7.62mm)
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Operating Temperature-40°C ~ 85°C
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ArchitectureR-2R
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INL/DNL (LSB)±2 (Max), ±1 (Max)
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Voltage - Supply, Digital5V
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Voltage - Supply, Analog5V
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Reference TypeExternal
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Data InterfaceParallel
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Differential OutputYes
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Output TypeCurrent - Unbuffered
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Settling Time1µs (Typ)
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Number of D/A Converters1
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Number of Bits16
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DigiKey ProgrammableNot Verified
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PackagingTube
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Product StatusActive
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Series-
The LC4384V-75F256C is a specific model of integrated circuit (IC) chip manufactured by Lattice Semiconductor. It belongs to the LatticeECP2M family of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this particular IC chip:Advantages: 1. High Logic Density: The LC4384V-75F256C offers a high logic density, allowing for the implementation of complex digital circuits and systems on a single chip. 2. Flexible and Reconfigurable: Being an FPGA, it is highly flexible and reconfigurable. Users can program and reprogram the chip to perform different functions, making it suitable for a wide range of applications. 3. Low Power Consumption: The chip is designed to consume low power, making it suitable for battery-powered devices or applications where power efficiency is crucial. 4. High-Speed Performance: The LC4384V-75F256C offers high-speed performance, enabling it to handle data-intensive applications and real-time processing requirements.Application Scenarios: 1. Communications: The chip can be used in various communication systems, such as wireless base stations, routers, and network switches, to implement signal processing, protocol handling, and data routing functions. 2. Industrial Automation: It can be utilized in industrial automation systems for tasks like motor control, sensor interfacing, and data acquisition, providing real-time control and monitoring capabilities. 3. Video and Image Processing: The high logic density and speed of the chip make it suitable for video and image processing applications, including video encoding/decoding, image recognition, and computer vision. 4. Aerospace and Defense: The chip's reconfigurability and high-speed performance make it suitable for aerospace and defense applications, such as radar systems, avionics, and secure communication systems. 5. Internet of Things (IoT): The low power consumption and flexibility of the chip make it suitable for IoT devices, where it can be used for sensor data processing, connectivity, and edge computing.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design choices made by the user.
LTC1599BIN#PBF Relevant information