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BU2507FV-E2

BU2507FV-E2

Manufacturer No:

BU2507FV-E2

Manufacturer:

Description:

IC DAC 10BIT V-OUT 14SSOPB

Datasheet:

Datasheet

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BU2507FV-E2 Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    14-SSOP-B
  • Package / Case
    14-LSSOP (0.173", 4.40mm Width)
  • Operating Temperature
    -30°C ~ 85°C
  • Architecture
    R-2R
  • INL/DNL (LSB)
    ±3.5 (Max), ±1 (Max)
  • Voltage - Supply, Digital
    5V
  • Voltage - Supply, Analog
    5V
  • Reference Type
    Supply
  • Data Interface
    SPI
  • Differential Output
    No
  • Output Type
    Voltage - Buffered
  • Settling Time
    20µs
  • Number of D/A Converters
    6
  • Number of Bits
    10
  • DigiKey Programmable
    Not Verified
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The BU2507FV-E2 is a specific integrated circuit (IC) chip designed for use in audio power amplifiers. Here are some advantages and application scenarios of this chip:Advantages: 1. High Power Output: The BU2507FV-E2 chip is capable of delivering high power output, making it suitable for applications that require loud and clear audio amplification. 2. Low Distortion: This IC chip is designed to minimize distortion in the audio signal, ensuring high-quality sound reproduction. 3. Thermal Protection: It includes built-in thermal protection mechanisms to prevent overheating and damage to the chip during prolonged use. 4. Compact Size: The BU2507FV-E2 chip is available in a compact package, making it suitable for space-constrained applications.Application Scenarios: 1. Audio Amplifiers: The primary application of the BU2507FV-E2 chip is in audio amplifiers, where it can be used to amplify audio signals from various sources such as microphones, musical instruments, or audio playback devices. 2. Home Theater Systems: This chip can be used in home theater systems to amplify audio signals for surround sound speakers, providing an immersive audio experience. 3. Car Audio Systems: The BU2507FV-E2 chip can be used in car audio systems to amplify audio signals from the head unit and deliver powerful sound output to the speakers. 4. Public Address Systems: It can be used in public address systems, such as in stadiums, auditoriums, or conference halls, to amplify audio signals for large audiences. 5. Professional Audio Equipment: The chip can be used in professional audio equipment like mixers, amplifiers, or studio monitors, where high-quality audio amplification is required.It's important to note that the specific advantages and application scenarios may vary depending on the overall design and implementation of the audio system using the BU2507FV-E2 chip.
BU2507FV-E2 Relevant information