THS1230CDW

THS1230CDW

Manufacturer No:

THS1230CDW

Manufacturer:

Texas Instruments

Description:

IC ADC 12BIT PIPELINED 28SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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THS1230CDW Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    28-SOIC
  • Package / Case
    28-SOIC (0.295", 7.50mm Width)
  • Operating Temperature
    0°C ~ 70°C
  • Features
    -
  • Voltage - Supply, Digital
    3V ~ 3.6V
  • Voltage - Supply, Analog
    3V ~ 3.6V
  • Reference Type
    External, Internal
  • Architecture
    Pipelined
  • Number of A/D Converters
    1
  • Ratio - S/H:ADC
    1:1
  • Configuration
    S/H-ADC
  • Data Interface
    Parallel
  • Input Type
    Differential
  • Number of Inputs
    1
  • Sampling Rate (Per Second)
    30M
  • Number of Bits
    12
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The MX7535KN is a specific model of integrated circuit (IC) chip. However, there is limited information available about this specific chip, and it is not widely known or commonly used. Therefore, it is difficult to provide specific advantages and application scenarios for the MX7535KN.In general, the advantages of IC chips include:1. Miniaturization: IC chips are small in size and can pack a large number of electronic components into a small space, leading to compact and lightweight devices. 2. Reliability: IC chips are manufactured using advanced processes, ensuring high reliability and long-term performance. 3. Power efficiency: IC chips are designed to operate with low power consumption, making them suitable for battery-powered devices. 4. Cost-effectiveness: Mass production of IC chips reduces the cost per unit, making them affordable for various applications. 5. Integration: IC chips can integrate multiple functions or components into a single chip, simplifying circuit design and reducing the number of external components.However, without specific information about the MX7535KN chip, it is not possible to provide accurate application scenarios. It is recommended to refer to the datasheet or technical documentation provided by the manufacturer for detailed information about the chip's features, advantages, and potential applications.