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ADC1453D250NGG-C18

ADC1453D250NGG-C18

Manufacturer No:

ADC1453D250NGG-C18

Description:

IC ADC 14BIT PIPELINED 56VFQFPN

Datasheet:

Datasheet

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ADC1453D250NGG-C18 Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    56-VFQFPN (8x8)
  • Package / Case
    56-LFQFN Exposed Pad
  • Operating Temperature
    -40°C ~ 85°C
  • Features
    Simultaneous Sampling
  • Voltage - Supply, Digital
    1.7V ~ 1.9V
  • Voltage - Supply, Analog
    1.7V ~ 1.9V
  • Reference Type
    External
  • Architecture
    Pipelined
  • Number of A/D Converters
    1
  • Ratio - S/H:ADC
    1:1
  • Configuration
    S/H-ADC
  • Data Interface
    JESD204A
  • Input Type
    Differential, Single Ended
  • Number of Inputs
    2
  • Sampling Rate (Per Second)
    246M
  • Number of Bits
    14
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The PM7533HP integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Power Efficiency: The PM7533HP chips are designed to provide high power efficiency, which means they can deliver power to devices while minimizing energy loss. This makes them suitable for applications where power efficiency is crucial, such as in data centers or telecommunications infrastructure.2. High Power Density: These chips offer high power density, meaning they can deliver a significant amount of power in a compact form factor. This makes them ideal for applications where space is limited, such as in small form factor devices or densely packed electronic systems.3. Advanced Thermal Management: The PM7533HP chips incorporate advanced thermal management techniques, allowing them to dissipate heat efficiently. This ensures reliable operation even under high power loads and prevents overheating issues. It is particularly useful in applications where heat dissipation is a concern, such as in power supplies or motor control systems.4. Scalability and Flexibility: These chips are designed to be scalable and flexible, allowing them to be used in a wide range of applications. They can be easily integrated into different systems and can adapt to varying power requirements, making them versatile for various use cases.Application Scenarios: 1. Data Centers: The high power efficiency and density of PM7533HP chips make them suitable for use in data centers, where power consumption and space constraints are critical. They can be used in power distribution units, server power supplies, or other infrastructure components.2. Telecommunications: These chips can be used in telecommunications equipment, such as base stations or network switches, where high power density and efficiency are required. They can help optimize power delivery and reduce energy consumption in these systems.3. Industrial Automation: PM7533HP chips can be utilized in industrial automation applications, such as motor control systems or power supplies for robotics. Their high power density and thermal management capabilities make them suitable for demanding industrial environments.4. Electric Vehicles: The high power efficiency and density of these chips make them suitable for electric vehicle applications. They can be used in power conversion systems, battery management systems, or charging infrastructure, enabling efficient power delivery and management.5. Renewable Energy: PM7533HP chips can be employed in renewable energy systems, such as solar or wind power inverters. Their high power efficiency and thermal management capabilities help maximize energy conversion and ensure reliable operation.Overall, the PM7533HP integrated circuit chips offer advantages in power efficiency, density, thermal management, and flexibility, making them suitable for a wide range of applications in various industries.
ADC1453D250NGG-C18 Relevant information