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HI5714/7CB

HI5714/7CB

Manufacturer No:

HI5714/7CB

Manufacturer:

Harris Corporation

Description:

IC ADC 8BIT FOLD INTERPOL 24SOIC

Datasheet:

Datasheet

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HI5714/7CB Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    24-SOIC
  • Package / Case
    24-SOIC (0.295", 7.50mm Width)
  • Operating Temperature
    0°C ~ 70°C
  • Features
    -
  • Voltage - Supply, Digital
    4.75V ~ 5.25V
  • Voltage - Supply, Analog
    4.75V ~ 5.25V
  • Reference Type
    External
  • Architecture
    Folding Interpolating
  • Number of A/D Converters
    1
  • Ratio - S/H:ADC
    0:1
  • Configuration
    ADC
  • Data Interface
    -
  • Input Type
    Single Ended
  • Number of Inputs
    1
  • Sampling Rate (Per Second)
    40M
  • Number of Bits
    8
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The HI5714/7CB integrated circuit chips are high-speed, low-power, and low-voltage serializers and deserializers (SerDes) designed for high-speed data transmission applications. Some of the advantages and application scenarios of these chips are:1. High-speed data transmission: The HI5714/7CB chips support data rates up to 28 Gbps, making them suitable for applications that require high-speed data transmission, such as high-definition video streaming, data centers, and telecommunications.2. Low power consumption: These chips are designed to operate at low power, making them energy-efficient and suitable for battery-powered devices or applications where power consumption is a concern.3. Low-voltage operation: The HI5714/7CB chips operate at low voltages, typically 1.8V, which makes them compatible with low-voltage systems and reduces power consumption.4. Small form factor: These chips are available in small form factors, such as chip-scale packages, which make them suitable for space-constrained applications, including portable devices, embedded systems, and compact electronics.5. Signal integrity and error correction: The HI5714/7CB chips incorporate advanced signal integrity features, such as equalization and adaptive decision feedback, to compensate for signal distortions and improve data transmission quality. They also support forward error correction (FEC) techniques to enhance data reliability and reduce errors.6. Application scenarios: The HI5714/7CB chips find applications in various industries, including telecommunications, networking, data centers, video broadcasting, medical imaging, and automotive electronics. They are used in high-speed data links, optical transceivers, backplanes, high-speed interconnects, and other applications that require high-speed data transmission with low power consumption and small form factors.Overall, the HI5714/7CB integrated circuit chips offer high-speed, low-power, and low-voltage data transmission capabilities, making them suitable for a wide range of applications where high-speed data transfer, energy efficiency, and compact size are essential.
HI5714/7CB Relevant information